In situ study of void growth kinetics in electroplated Cu lines

Journal of Applied Physics

Volumn 92, Issue 4, 2002, Pages 1803-1810

  Liniger, E ^a   Gignac, L ^a   Hu, C K ^a   Kaldor, S ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER DAMASCENE; COPPER DIFFUSION; CU LINES; DIFFUSION PATHS; EDGE DISPLACEMENT; ELECTRICAL RESISTANCES; IN-SITU; IN-SITU STUDY; NUCLEATION SITES; PHYSICAL CHANGES; POLYCRYSTALLINE STRUCTURE; SAMPLE TEMPERATURE; SCANNING ELECTRON MICROSCOPE; SECONDARY PATHS; TEST STRUCTURE; VOID GROWTH; VOID GROWTH RATE;

ACTIVATION ENERGY; COPPER; ELECTROMIGRATION; GRAIN BOUNDARIES; SCANNING ELECTRON MICROSCOPY;

GROWTH KINETICS;

EID: 0037103690     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1492871     Document Type: Article

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