Computational investigation of the evolution of intermetallic compounds affected by microvoids during the solid-state aging process in the Cu-Sn system

Journal of Electronic Materials

Volumn 42, Issue 6, 2013, Pages 999-1009

  Park, M S ^a   Gibbons, S L ^b   Arroyave R ^a  

^a Department of Electrical and Computer Engineering   (United States)

^b TEXAS A AND M UNIVERSITY   (United States)

Author keywords

growth of Cu6Sn5 and Cu3Sn layer; microvoids; morphology; Phase field model; roughness

Indexed keywords

COMPUTATIONAL INVESTIGATION; EXPERIMENTAL VALUES; INTERFACE ROUGHNESS; INTERFACIAL ROUGHNESS; MICRO VOIDS; MORPHOLOGICAL EVOLUTION; PHASE-FIELD MODELS; REACTION CONDITIONS;

INTERMETALLICS; MORPHOLOGY; SOLDERING ALLOYS; SURFACE ROUGHNESS; TIN;

COPPER COMPOUNDS;

EID: 84877790616     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-013-2494-2     Document Type: Article

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