Computational investigation of intermetallic compounds (Cu 6Sn5 and Cu3Sn) growth during solid-state aging process

Computational Materials Science

Volumn 50, Issue 5, 2011, Pages 1692-1700

  Park, M S ^a   Arroyave R ^a,b  

^a Department of Electrical and Computer Engineering   (United States)

^b TEXAS A AND M UNIVERSITY   (United States)

Author keywords

Cu3Sn; Cu6Sn5; Intermetallic compound growth; Lead free soldering; Morphology; Multiphase field model; Solid state aging

Indexed keywords

CU3SN; CU6SN5; INTERMETALLIC COMPOUND GROWTHS; LEAD-FREE SOLDERING; MULTI-PHASE-FIELD MODEL; SOLID-STATE AGING;

COMPUTER SIMULATION; GRAIN BOUNDARIES; GROWTH KINETICS; INTERMETALLICS; LEAD COMPOUNDS; MORPHOLOGY; PHASE INTERFACES; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 79952008634     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2010.12.030     Document Type: Article

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