Multiphase field simulations of intermetallic compound growth during lead-free soldering

Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2525-2533

  Park, M S ^a   Arroyave R ^a  

^a Department of Electrical and Computer Engineering   (United States)

Author keywords

Cu 3Sn; Cu 6Sn 5; Intermetallic compound growth; Lead free soldering; Morphology; Multiphase field model

Indexed keywords

CALPHAD; COEXISTING PHASIS; COMPUTATIONAL DOMAINS; COPPER SUBSTRATES; CU 6SN 5; FIELD MODEL; FIELD SIMULATION; GRAIN COARSENING; IMC LAYER; INTERFACE STRUCTURES; INTERFACIAL REGION; INTERMETALLIC COMPOUND GROWTHS; INTERMETALLIC COMPOUNDS; KINETIC BEHAVIOR; LEAD-FREE SOLDERING; LIQUID PHASE; MODEL PARAMETERS; MORPHOLOGICAL EVOLUTION; SN-BASED SOLDERS; THERMODYNAMIC DATABASE;

DISSOLUTION; GRAIN BOUNDARIES; GRAIN GROWTH; GROWTH KINETICS; LEAD; LEAD COMPOUNDS; LIQUIDS; MATHEMATICAL MODELS; METAL RECOVERY; MORPHOLOGY; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SIMULATORS; SOLDERING; SOLDERING ALLOYS; SUBSTRATES;

TIN;

EID: 72549107540     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0849-5     Document Type: Article

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