Early stages of intermetallic compound formation and growth during lead-free soldering

Acta Materialia

Volumn 58, Issue 14, 2010, Pages 4900-4910

  Park, M S ^a   Arroyave R ^a  

^a Department of Electrical and Computer Engineering   (United States)

Author keywords

Intermetallic compound growth; Lead free soldering; Morphology; Multi phase field model; Nucleation of Cu6Sn5

Indexed keywords

CU SUBSTRATE; GRAIN-BOUNDARY DIFFUSION; HETEROGENEOUS NUCLEATION; IMC THICKNESS; INTERFACE ENERGY; INTERMETALLIC COMPOUND GROWTHS; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDERING; LIQUID SOLDERS; LOCAL EQUILIBRIUM; MORPHOLOGICAL EVOLUTION; MULTI-PHASE-FIELD MODEL; PHASE-FIELD APPROACHES; PHASE-FIELD SIMULATION; POISSON PROCESS; SN-BASED SOLDERS; SOLDERING REACTIONS;

COALESCENCE; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; GROWTH KINETICS; LEAD; LEAD COMPOUNDS; LIQUIDS; MORPHOLOGY; NUCLEATION; PHASE INTERFACES; POISSON DISTRIBUTION; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TIN;

SOLDERING;

EID: 77953869860     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.05.028     Document Type: Article

References (39)

1. Abtew M., and Selvaduray G. Mater Sci Eng R 27 (2000) 95
2. Tu K.N., and Zeng K. Mater Sci Eng R 27 (2001) 1
3. Laurila T., Vuorinen V., and Kivilahti J.K. Mater Sci Eng R 49 (2005) 1
4. Mei Z., Sunwoo A.J., and Morris Jr. J.W. Metall Trans A 23 (1992) 857
5. Wu Y., and Sees J.A. J Electron Mater 7 (1993) 769
6. Frear D.R., and Vianco P.T. Metall Mater Trans A 25 (1994) 1509
7. Bader S., Gust W., and Hieber H. Acta Metall Mater 43 (1995) 329
8. Kim H.K., and Tu K.N. Appl Phys Lett 67 (1995) 2002
9. Kim H.K., and Tu K.N. Phys Rev B 53 (1996) 16027
10. Kang S.K., Rai R.S., and Purushothaman S. J Electron Mater 25 (1997) 1113
11. Lee Y.G., and Duh J.G. J Mater Sci 33 (1998) 5567
12. Schaefer M., Fournelle R.A., and Liang J. J Electron Mater 27 (1998) 1167
13. Zhong C.H., and Yi S. Soldering Surface Mount Tech 11 (1999) 44
14. Choi W.K., and Lee H.M. J Electron Mater 29 (2000) 1207
15. Shin C.K., Baik Y.J., and Huh Y.J. J Electron Mater 30 (2001) 1323
16. Tu P.L., Chan Y.C., Hung K.C., and Lai J.K.L. Scripta Mater 44 (2001) 317
17. Kim K.S., Huh S.H., and Suganuma. J Alloys Compd 352 (2003) 226
18. Gorlich J., and Schmitza G. Appl Phys Lett 86 (2005) 053106
19. Kim S.G., Kim W.T., and Suzuki T. Phys Rev E 60 (1999) 7186
20. Steinbach I., and Pezzolla F. Physica D 134 (1999) 385
21. Ode M., Koyama T., Onodera H., and Suzuki T. J Electron Mater 32 (2003) 1534
22. Hong K.K., and Huh J.Y. J Electron Mater 35 (2006) 56
23. Huh J.Y., Hong K.K., Kim Y.B., and Kim K.T. J Electron Mater 33 (2004) 1161
24. Park M.S., and Arroyave R. J Electron Mater 38 (2009) 2525
25. Kim S.G., Kim W.T., Suzuki T., and Ode M. J Cryst Growth 261 (2004) 135
26. Shim J.H., Oh C.S., Lee B.J., and Lee D.N. Z Metallkd 87 (1996) 205
27. Simmon J.P., Shen C., and Wang Y. Scripta Mater 43 (2000) 935
28. Simmon J.P., Wen Y., Shen C., and Wang Y.Z. Mater Sci Eng A 365 (2004) 136
29. Li J., Wang J., and Yang G. J Cryst Growth 309 (2007) 65
30. Wen Y.H., Simmon J.P., Shen C., Woodward C., and Wang Y. Acta Mater 51 (2003) 1123
31. Warren J., Pusztai T., Környei L., and Gránásy L. Phys Rev B 79 (2009) 014204
32. Lee B.J., Hwang N.M., and Lee H.M. Acta Mater 45 (1997) 1867
33. Qin R.S., and Wallach E.R. Acta Mater 51 (2003) 6199
34. Gagliano R.A., Ghosh G., and Find M.E. J Electron Mater 31 (2002) 1195
35. Lord R.A., and Umantsev A. J Appl Phys 98 (2005) 063525
36. Pan C., Yu C., and Lin K. Appl Phys Lett 93 (2008) 061912
37. Gong J., Liu C., Conway P., and Silberschmodt V. Acta Mater 56 (2008) 4291
38. Robson J.D. Acta Mater 52 (2004) 4669
39. Zhang H. Intl J Heat Mass Transfer 47 (2003) 2191