SCOPUS 정보 검색 플랫폼

Computational Materials Science

Volumn 45, Issue 3, 2009, Pages 827-831

Kirkendall voids in the intermetallic layers of solder joints in MEMS

(3) Weinberg, Kerstin a Böhme, Thomas b Müller, Wolfgang H c

a UNIVERSITY OF SIEGEN (Germany)

b THYSSENKRUPP STEEL EUROPE AG (Germany)

c TECHNISCHE UNIVERSITÄT BERLIN (Germany)

Author keywords

Intermetallic compounds; Kirkendall effect; Nucleation; Plastic deformation; Vacancy diffusion

Indexed keywords

ELECTRO MECHANICALS; EXPERIMENTAL OBSERVATIONS; INTERMETALLIC COMPOUNDS; INTERMETALLIC LAYERS; KIRKENDALL EFFECT; KIRKENDALL VOIDS; METAL LAYERS; MICROELECTRONIC SYSTEMS; NUMERICAL SIMULATIONS; SOLDER ALLOYS; SOLDER JOINTS; SPHERICAL VOIDS; TEMPORAL DEVELOPMENT; VACANCY DIFFUSION; VOID NUCLEATIONS;

BRAZING; DIFFUSION; FAILURE ANALYSIS; NUCLEATION; PLASTIC DEFORMATION; PLASTICS; QUALITY ASSURANCE; SAFETY FACTOR; SEMICONDUCTING INTERMETALLICS; SOLIDS; SURFACE DIFFUSION; SURFACE TENSION; VACANCIES; WELDING;

SOLDERING ALLOYS;

EID: 64549117274 PISSN: 09270256 EISSN: None Source Type: Journal
DOI: 10.1016/j.commatsci.2008.09.028 Document Type: Article

Times cited : (38)

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