Phase field simulations of morphological evolution and growth kinetics of solder reaction products

Journal of Electronic Materials

Volumn 35, Issue 1, 2006, Pages 56-64

  Hong, K K ^a   Huh, J Y ^a  

^a Korea University   (South Korea)

Author keywords

Grain boundary (gb) diffusion; Growth kinetics; Intermetallic compound (imc); Morphology; Phase field simulation; Solder reaction

Indexed keywords

GRAIN BOUNDARY (GB) DIFFUSION; INTERMETALLIC COMPOUND (IMC); PHASE FIELD SIMULATION; SOLDER REACTION;

COMPUTER SIMULATION; GRAIN BOUNDARIES; GROWTH KINETICS; INTERFACIAL ENERGY; INTERMETALLICS; MORPHOLOGY;

SOLDERING ALLOYS;

EID: 32644436155     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0184-z     Document Type: Conference Paper

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