메뉴 건너뛰기




Volumn 60, Issue 3, 2012, Pages 923-934

Concurrent nucleation, formation and growth of two intermetallic compounds (Cu 6Sn 5 and Cu 3Sn) during the early stages of lead-free soldering

Author keywords

Concurrent nucleation; Intermetallic compound growth; Lead free soldering; Morphology; Multiphase field model

Indexed keywords

CALPHAD; CLASSICAL NUCLEATION THEORY; DIFFUSION RATE; DOMINANT MECHANISM; DRIVING FORCES; IMC LAYER; INTERMETALLIC COMPOUND GROWTH; LEAD-FREE SOLDERING; MODEL PARAMETERS; MORPHOLOGICAL EVOLUTION; MULTI-PHASE-FIELD MODEL; NUCLEATION PARAMETERS; NUCLEATION RATE; PARAMETRIC INVESTIGATIONS; PB-FREE; POISSON PROCESS; THERMODYNAMIC MODEL;

EID: 83455178089     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2011.10.053     Document Type: Article
Times cited : (83)

References (51)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.