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Volumn 60, Issue 3, 2012, Pages 923-934
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Concurrent nucleation, formation and growth of two intermetallic compounds (Cu 6Sn 5 and Cu 3Sn) during the early stages of lead-free soldering
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Author keywords
Concurrent nucleation; Intermetallic compound growth; Lead free soldering; Morphology; Multiphase field model
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Indexed keywords
CALPHAD;
CLASSICAL NUCLEATION THEORY;
DIFFUSION RATE;
DOMINANT MECHANISM;
DRIVING FORCES;
IMC LAYER;
INTERMETALLIC COMPOUND GROWTH;
LEAD-FREE SOLDERING;
MODEL PARAMETERS;
MORPHOLOGICAL EVOLUTION;
MULTI-PHASE-FIELD MODEL;
NUCLEATION PARAMETERS;
NUCLEATION RATE;
PARAMETRIC INVESTIGATIONS;
PB-FREE;
POISSON PROCESS;
THERMODYNAMIC MODEL;
COMPUTER SIMULATION;
GRAIN BOUNDARIES;
GRAIN GROWTH;
INTERMETALLICS;
LEAD;
MORPHOLOGY;
POISSON DISTRIBUTION;
SOLDERING;
SOLDERING ALLOYS;
STOCHASTIC MODELS;
TIN;
NUCLEATION;
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EID: 83455178089
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2011.10.053 Document Type: Article |
Times cited : (83)
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References (51)
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