Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions

Acta Materialia

Volumn 60, Issue 18, 2012, Pages 6278-6287

  Park, M S ^a   Gibbons, S L ^a,b   Arroyave R ^a,b  

^a Department of Electrical and Computer Engineering   (United States)

^b TEXAS A AND M UNIVERSITY   (United States)

Author keywords

Cu Sn; Intermetallic compound growth; Pb free soldering; Phase field simulations; Transient liquid phase bonding

Indexed keywords

CU-SN; INTERMETALLIC COMPOUND GROWTHS; PB-FREE; PHASE-FIELD SIMULATION; TRANSIENT LIQUID PHASE BONDING;

EXPERIMENTS; GROWTH RATE; LEAD; LEAD COMPOUNDS; LIQUIDS; MORPHOLOGY;

TIN;

EID: 84866730391     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2012.07.063     Document Type: Article

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