Kinetics of intermetallic compound formation at the interface between Sn-3.0Ag-0.5Cu solder and Cu-Zn alloy substrates

Journal of Electronic Materials

Volumn 39, Issue 12, 2010, Pages 2504-2512

  Kim, Young Min ^a   Roh, Hee Ra ^a   Kim, Sungtae ^b   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

^b UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

activation energy; Cu Zn alloy; intermetallic compound; kinetics; microvoids

Indexed keywords

AGING PROCESS; AGING TEMPERATURES; AGING TIME; BI-LAYER; CU SUBSTRATE; CU-ZN ALLOY; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; LAYER GROWTH; MICRO VOIDS; MOLTEN SOLDERS; SCALLOP-SHAPED; SN-3.0AG-0.5CU; SN-3.5AG; VOLUME DIFFUSION;

ACTIVATION ENERGY; CERIUM ALLOYS; GROWTH KINETICS; INTERMETALLICS; REACTION KINETICS; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; TIN; TIN ALLOYS; ZINC; ZINC ALLOYS;

COPPER ALLOYS;

EID: 78049500125     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1379-x     Document Type: Conference Paper

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