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Volumn 32, Issue 4, 2011, Pages 309-319

Intrinsic and interdiffusion in Cu-Sn system

Author keywords

interdiffusion; intrinsic diffusion; Kirkendall Voids

Indexed keywords

ALUMINA PARTICLES; DIFFUSION COUPLE; INTERDIFFUSION COEFFICIENTS; INTERMETALLIC PHASIS; INTRINSIC DIFFUSION; INTRINSIC DIFFUSIVITY; KIRKENDALL EFFECTS; KIRKENDALL VOID; MICRO VOIDS; SOLID-SOLID;

EID: 80052651805     PISSN: 15477037     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11669-011-9907-9     Document Type: Article
Times cited : (103)

References (40)
  • 1
    • 61849155291 scopus 로고    scopus 로고
    • First-Principles Investigation of Migration Barriers and Point Defect Complexes in B2-NiAl
    • 10.1016/j.intermet.2008.11.007
    • Q Xu A Van der Ven 2009 First-Principles Investigation of Migration Barriers and Point Defect Complexes in B2-NiAl Intermetallics 17 5 319 329 10.1016/j.intermet.2008.11.007
    • (2009) Intermetallics , vol.17 , Issue.5 , pp. 319-329
    • Xu, Q.1    Van Der Ven, A.2
  • 2
    • 19944432174 scopus 로고    scopus 로고
    • Kirkendall Void Formation in Eutectic SnPb Solder Joints on Bare Cu and Its Effect on Joint Reliability
    • 2005JAP.97b4508Z
    • RS Kejun Zeng T-C Chiu D Edwards K Ano KN Tu 2005 Kirkendall Void Formation in Eutectic SnPb Solder Joints on Bare Cu and Its Effect on Joint Reliability J. Appl. Phys. 97 2 024508-8 2005JAP....97b4508Z
    • (2005) J. Appl. Phys. , vol.97 , Issue.2 , pp. 024508-8
    • Kejun Zeng, R.S.1    Chiu, T.-C.2    Edwards, D.3    Ano, K.4    Tu, K.N.5
  • 5
    • 33845594178 scopus 로고    scopus 로고
    • Effect of intel-metallic and kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint
    • DOI 10.1109/ECTC.2006.1645659, 1645659, Proceedings - IEEE 56th Electronic Components and Technology Conference
    • L. Xu and J.H.L. Pang, Effect of Intermetallic and Kirkendall Voids Growth on Board Level Drop Reliability for SnAgCu Lead-Free BGA Solder Joint, 56th Electronic Components and Technology Conference and Proceedings, 2006, p 275-282 (Pubitemid 44929689)
    • (2006) Proceedings - Electronic Components and Technology Conference , vol.2006 , pp. 275-282
    • Xu, L.1    Pang, J.H.L.2
  • 6
    • 24644438312 scopus 로고    scopus 로고
    • Kirkendall voids at Cu/solder interface and their effects on solder joint reliability
    • 2005 Proceedings - 55th Electronic Components and Technology Conference, ECTC
    • Z. Mei, M. Ahmad, M. Hu, and G. Ramakrishna, Kirkendall Voids and Cu/Solder Interface and Their Effects on Solder Joint Reliability, 55th Proceedings of Electronic Components and Technology Conference, 2005, p 415-420 (Pubitemid 41276204)
    • (2005) Proceedings - Electronic Components and Technology Conference , vol.1 , pp. 415-420
    • Mei, Z.1    Ahmad, M.2    Hu, M.3    Ramakrishna, G.4
  • 8
    • 82955248445 scopus 로고    scopus 로고
    • Void Formation: Emerging Issues in Materials Compatibility and Reliability of PB-Free Assembllies
    • Vienna, Austria
    • C.A. Handwerker, E. Erk, A. Hess, A. Squire, and M. Yarbrough, Void Formation: Emerging Issues in Materials Compatibility and Reliability of PB-Free Assembllies, Going Green Care Innovation, Vienna, Austria, 2006
    • (2006) Going Green Care Innovation
    • Handwerker, C.A.1    Erk, E.2    Hess, A.3    Squire, A.4    Yarbrough, M.5
  • 9
    • 55649108206 scopus 로고    scopus 로고
    • Influence of Plating Parameters and Solution Chemistry on the Voiding Propensity at Electrodeposited Copper-Solder Interface
    • 10.1007/s10800-008-9618-z
    • Y Liu J Wang P Kondos P Borgesen DW Handerson EJ Cotts N Dimitrov 2008 Influence of Plating Parameters and Solution Chemistry on the Voiding Propensity at Electrodeposited Copper-Solder Interface J. Appl. Electrochem. 38 12 1695 1705 10.1007/s10800-008-9618-z
    • (2008) J. Appl. Electrochem. , vol.38 , Issue.12 , pp. 1695-1705
    • Liu, Y.1    Wang, J.2    Kondos, P.3    Borgesen, P.4    Handerson, D.W.5    Cotts, E.J.6    Dimitrov, N.7
  • 11
    • 0020778970 scopus 로고
    • Kirkendall effect in Cu-Sn alloys
    • DOI 10.1016/0036-9748(83)90272-7
    • AG Guy 1983 Kirkendall Effect in Cu-Sn Alloys Scripta Metall. 17 7 967 968 748773 10.1016/0036-9748(83)90272-7 (Pubitemid 14583990)
    • (1983) Scripta metallurgica , vol.17 , Issue.7 , pp. 967-968
    • Guy, A.G.1
  • 13
    • 0342700846 scopus 로고
    • Interface and Marker Movements in Diffusion in Solid Solutions of Metals
    • LCC Dasilva RF Mehl 1951 Interface and Marker Movements in Diffusion in Solid Solutions of Metals J. Met. 3 2 155 173
    • (1951) J. Met. , vol.3 , Issue.2 , pp. 155-173
    • Dasilva, L.C.C.1    Mehl, R.F.2
  • 15
    • 33845575782 scopus 로고    scopus 로고
    • Laboratory of Materials and Interface Chemistry, Eindhoven University of Technology
    • A. Paul, The Kirkendall Effect in Solid State Diffusion, Laboratory of Materials and Interface Chemistry, Eindhoven University of Technology, 2004
    • (2004) The Kirkendall Effect in Solid State Diffusion
    • Paul, A.1
  • 16
    • 79954592627 scopus 로고    scopus 로고
    • Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System
    • A. Paul, C. Ghosh, and W.J. Boettinger, Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System, Metall. Mater. Trans. A, 2011, 42A, p 952-963
    • (2011) Metall. Mater. Trans. A , vol.42 , pp. 952-963
    • Paul, A.1    Ghosh, C.2    Boettinger, W.J.3
  • 17
    • 0011498539 scopus 로고
    • Properties and Selection: Nonferrous Alloys and Pure Metals
    • 9th ed., ASM
    • Properties and Selection: Nonferrous Alloys and Pure Metals, Metal Handbooks, Vol 2, 9th ed., ASM, 1979
    • (1979) Metal Handbooks , vol.2
  • 19
    • 51249162222 scopus 로고
    • Analysis of Low-Temperature Intermetallic Growth in Copper-Tin Diffusion Couples
    • ZS Mei AJ Sunwoo JW Morris 1992 Analysis of Low-Temperature Intermetallic Growth in Copper-Tin Diffusion Couples Metall. Trans. A 23 857 864
    • (1992) Metall. Trans. A , vol.23 , pp. 857-864
    • Mei, Z.S.1    Sunwoo, A.J.2    Morris, J.W.3
  • 21
    • 0000518942 scopus 로고
    • The Relation between the Diffusion Coefficients and Concentrations of Solid Metals
    • C Matano 1933 The Relation Between the Diffusion Coefficients and Concentrations of Solid Metals Jpn. J. Phys. 8 109 113
    • (1933) Jpn. J. Phys. , vol.8 , pp. 109-113
    • Matano, C.1
  • 22
    • 0006767219 scopus 로고
    • A General Simplification and Improvement of the Matano-Boltzmann Method in the Determination of the Interdiffusion Coefficients in Binary Systems
    • 10.1016/0036-9748(69)90296-8
    • FJA den Broeder 1969 A General Simplification and Improvement of the Matano-Boltzmann Method in the Determination of the Interdiffusion Coefficients in Binary Systems Scripta Metall. 3 5 321 325 10.1016/0036-9748(69)90296-8
    • (1969) Scripta Metall. , vol.3 , Issue.5 , pp. 321-325
    • Den Broeder, F.J.A.1
  • 23
    • 0001525522 scopus 로고
    • Diffusion in Binaren Gemischen Mit Volumenanderung
    • in German
    • F Sauer V Freise 1962 Diffusion in Binaren Gemischen Mit Volumenanderung Zeitschrift Fur Elektrochemie 66 4 353 363 in German
    • (1962) Zeitschrift fur Elektrochemie , vol.66 , Issue.4 , pp. 353-363
    • Sauer, F.1    Freise, V.2
  • 24
    • 0014867480 scopus 로고
    • On the Determination of Diffusion Coefficients in a Binary Metal System
    • 10.1016/0001-6160(70)90009-X
    • FJJ Van Loo 1970 On the Determination of Diffusion Coefficients in a Binary Metal System Acta Metall. 18 10 1107 1111 10.1016/0001-6160(70)90009-X
    • (1970) Acta Metall. , vol.18 , Issue.10 , pp. 1107-1111
    • Van Loo, F.J.J.1
  • 25
    • 49649149707 scopus 로고
    • Treatment of Diffusion Considering Changes in Atomic Volume
    • 1540838 10.1016/0036-9748(71)90194-3
    • AG Guy 1971 Treatment of Diffusion Considering Changes in Atomic Volume Scripta Metall. 5 4 279 281 1540838 10.1016/0036-9748(71)90194-3
    • (1971) Scripta Metall. , vol.5 , Issue.4 , pp. 279-281
    • Guy, A.G.1
  • 26
    • 0014467621 scopus 로고
    • Evaluation of Data Obtained with Diffusion Couples of Binary Single-Phase and Multiphase Systems
    • 10.1016/0001-6160(69)90131-X
    • C Wagner 1969 Evaluation of Data Obtained with Diffusion Couples of Binary Single-Phase and Multiphase Systems Acta Metall. 17 2 99 107 10.1016/0001-6160(69)90131-X
    • (1969) Acta Metall. , vol.17 , Issue.2 , pp. 99-107
    • Wagner, C.1
  • 31
    • 0001314605 scopus 로고
    • Average Effective Interdiffusion Coefficients in Binary and Multicomponent Alloys
    • 10.4028/www.scientific.net/DDF.95-98.521
    • MA Dayananda 1993 Average Effective Interdiffusion Coefficients in Binary and Multicomponent Alloys Defect Diffus. Forum 95-98 521 536 10.4028/www.scientific.net/DDF.95-98.521
    • (1993) Defect Diffus. Forum , vol.9598 , pp. 521-536
    • Dayananda, M.A.1
  • 32
    • 80052654208 scopus 로고
    • Intermetallic Compounds Formed in Solder Joints-Preparation of Single Phase Samples, Metal Science of Joining
    • Cincinnati
    • R.J. Schaefer, F.S. Biancaniello, and R.D. Jiggetts, Intermetallic Compounds Formed in Solder Joints-Preparation of Single Phase Samples, Metal Science of Joining, Proceedings of TMS Symposium, Cincinnati, 1991
    • (1991) Proceedings of TMS Symposium
    • Schaefer, R.J.1    Biancaniello, F.S.2    Jiggetts, R.D.3
  • 33
    • 0004255385 scopus 로고
    • McGraw-Hill Book Company, Inc New York
    • P.G. Shewmon, Diffusion in Solids, McGraw-Hill Book Company, Inc, New York, 1963
    • (1963) Diffusion in Solids
    • Shewmon, P.G.1
  • 35
    • 0012305604 scopus 로고
    • Atomic Mobilities in Multicomponent Diffusion and Their Determination
    • MA Dayananda 1968 Atomic Mobilities in Multicomponent Diffusion and Their Determination Trans. Met. Soc. AIME 242 1369 1372
    • (1968) Trans. Met. Soc. AIME , vol.242 , pp. 1369-1372
    • Dayananda, M.A.1
  • 36
    • 0003548581 scopus 로고
    • Atom Movements: Diffusion and Mass Transport in Solids
    • Les Ulis, France
    • J. Philibert, Atom Movements: Diffusion and Mass Transport in Solids, Monographies de physique, Les Ulis, France, 1991, p 238
    • (1991) Monographies de Physique , pp. 238
    • Philibert, J.1
  • 37
    • 0001600401 scopus 로고
    • Diffusion, Mobility, and Their Interrelation Through Free Energy in Binary Metallic Systems
    • LS Darken 1948 Diffusion, Mobility, and Their Interrelation Through Free Energy in Binary Metallic Systems Trans. Met. Soc. AIME 175 184 201
    • (1948) Trans. Met. Soc. AIME , vol.175 , pp. 184-201
    • Darken, L.S.1
  • 38
    • 85130771445 scopus 로고    scopus 로고
    • Growth of Silicides and Interdiffusion in the Mo-Si System
    • 10.1007/s11661-999-0046-4
    • PC Tortorici MA Dayananda 1999 Growth of Silicides and Interdiffusion in the Mo-Si System Metall. Mater. Trans. A 30A 545 550 10.1007/s11661-999-0046-4
    • (1999) Metall. Mater. Trans. A , vol.30 , pp. 545-550
    • Tortorici, P.C.1    Dayananda, M.A.2
  • 39
    • 0015602228 scopus 로고
    • Wettability of Liquid Tin on Solid Copper
    • I Kawakatsu T Osawa 1973 Wettability of Liquid Tin on Solid Copper Trans. JIM 14 114 119
    • (1973) Trans. JIM , vol.14 , pp. 114-119
    • Kawakatsu, I.1    Osawa, T.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.