Roughness evolution of Cu6Sn5 intermetallic during soldering

Journal of Applied Physics

Volumn 86, Issue 9, 1999, Pages 4916-4921

  Zuruzi, A S ^a   Chiu, C H ^a   Lahiri, S K ^a   Tu, K N ^b  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000090589     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.371460     Document Type: Article

References (21)

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