Microstructure, mechanical, and thermal properties of the Sn-1Ag-0.5Cu solder alloy bearing Fe for electronics applications

Materials Science and Engineering: A

Volumn 551, Issue , 2012, Pages 160-168

  Shnawah, Dhafer Abdul Ameer ^a   Said, Suhana Binti Mohd ^a   Sabri, Mohd Faizul Mohd ^a   Badruddin, Irfan Anjum ^a   Che, Fa Xing ^b  

^a UNIVERSITY OF MALAYA   (Malaysia)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Fe addition; Mechanical properties; Microstructure properties; Sn 1Ag 0.5Cu alloy; Thermal properties

Indexed keywords

BEARINGS (MACHINE PARTS); BINARY ALLOYS; COPPER ALLOYS; DUCTILE FRACTURE; EPOXY RESINS; LEAD-FREE SOLDERS; MICROSTRUCTURE; SILVER ALLOYS; SURFACE ANALYSIS; TERNARY ALLOYS; TIN ALLOYS;

FE ADDITIONS; INTERMETALLICS COMPOUNDS; MATRIX; MECHANICAL AND THERMAL PROPERTIES; MICROSTRUCTURES PROPERTIES; SN GRAINS; SN-1AG-0.5CU ALLOY; SOLDER ALLOYS; WEAK INTERFACE; Β-SN;

THERMODYNAMIC PROPERTIES;

EID: 84862125066     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2012.04.115     Document Type: Article

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