Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging

Journal of Electronic Materials

Volumn 29, Issue 8, 2000, Pages 1021-1026

  Huang, M L ^a   Wu, C M L ^a   Lai, J K L ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; DISPERSIONS; FAILURE (MECHANICAL); INTERFACES (MATERIALS); INTERMETALLICS; MECHANICAL ALLOYING; METALLOGRAPHIC MICROSTRUCTURE; PARTICLES (PARTICULATE MATTER); SHEAR STRENGTH; SOLDERED JOINTS; SOLDERING ALLOYS; THERMODYNAMIC STABILITY;

THERMAL SHOCK;

TIN ALLOYS;

EID: 0034245836     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0167-4     Document Type: Article

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