Solidification and wetting behaviour of SnAgCu solder alloyed by reactive metal organic flux

Soldering and Surface Mount Technology

Volumn 22, Issue 1, 2010, Pages 19-25

  Zerrer, Patrick ^a   Fix, Andreas ^a   Hutter, Matthias ^b   Reichl, Herbert ^c  

^a ROBERT BOSCH GMBH   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Alloys; Flux; Metals; Organic compounds; Solder; Solidification

Indexed keywords

DESIGN/METHODOLOGY/APPROACH; MELTING AND SOLIDIFICATION; METAL ORGANIC; METAL ORGANIC COMPOUND; REACTIVE METALS; SNAGCU SOLDER; SOLDER; SOLDER PASTE; SOLDERING PROCESS; WETTING BEHAVIOUR;

ALLOYING; ALLOYING ELEMENTS; ALUMINUM; CERIUM ALLOYS; COBALT COMPOUNDS; CRYSTALLIZATION; IRON ALLOYS; METALS; MICROSTRUCTURE; ORGANOMETALLICS; SMELTING; SOLDERING; SOLIDIFICATION; SUPERCOOLING;

SOLDERING ALLOYS;

EID: 76049127713     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911011015111     Document Type: Article

References (32)

1. Allen, S.L., Notis, M.R., Chromik, R.R. and Richard, R.P. (2004), "Microstructural evolution in lead-free solder alloys: Part I. Cast Sn-Ag-Cu eutectic", J. Mater. Res., Vol.19, pp. 1417-1424
2. Amagai, M. (2008), "A study of nanoparticles in Sn-Ag based lead free solder", Microelectron. Reliab., Vol.48, pp. 1-16.
3. Anderson, I.E. (2007), "Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications", J. Mater. Sci. Mater. El., Vol.18, pp. 55-76.
4. Anderson, I.E. and Harringa, J.L. (2004), "Elevated temperature aging of solder joints based on Sn-Ag-Cu: effects on joint microstructure and shear strength", J. Electron. Mater., Vol.33, pp. 1485-1496
5. Andersson, C., Liu, L. and Liu, J. (2006), "Characterization of mechanical properties of eutectic Sn-Co-Cu lead free alloy", IEEE Proceedings of Electronics Systemintegration Technology Conference, ESTC 1st, Dresden, 5-7 September, pp. 152-160
6. Andersson, C., Lai, Z., Liu, J., Jiang, H. and Yu, Y. (2005), "Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders", Mat. Sci. Eng. A., Vol.394, pp. 20-27
7. Barry, N., Jones, I.P., Hirst, T., Fox, I.M. and Robins, J. (2007), "High-cycle fatigue testing of Pb-free solder joints", Solder. Surf. Mt. Tech., Vol.19, pp. 29-38.
8. Bartels, F., Protsch, W. and Kappeller, U. (2006), "The influence of ultra fine solder powder related to wafer bumping within the ultra fine pitch area", IEEE Proceedings of Electronics System-Integration Technology Conference, ESTC 1st, Dresden, 5-7 September, pp. 13-18.
9. Choi, S., Lee, J.G., Subramanian, K.N., Lucas, J.P. and Bieler, T.R. (2000), "Thermomechanical fatigue behavior of Sn-Ag solder joints", J. Electron. Mater., Vol.29, pp. 1249-1257
10. de Sousa, I., Henderson, D.W., Luc, P., Kang, K. and Shih, D.-Y. (2006), "The influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structures", IEEE Proceedings of Electronic Components and Technology Conference, ECTC 56th, San Diego, CA, pp. 1454-1460
11. European Union (2008), Official Journal of The European Union, 13 February 2003, Vol.L37, pp. 19-23.
12. Gao, F., Takemote, T., Nishikawa, H. and Komatsu, A. (2006), "Microstructure and mechanical properties evolution of intermetallics between Cu and Sn-3.5Ag solder doped by Ni-Co additives", J. Electron. Mater., Vol.35, pp. 905-911
13. Henderson, D.W., Woods, J.J., Bartelo, J., Korhonen, T.M., Korhonen, M.A., Lehman, L.P., Cotts, E.J., Kang, S.K., Lauro, P., Shih, Y., Goldsmith, C. and Puttlitz, K. (2004), "The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue", J. Mater. Res., Vol.19, pp. 1608-1612
14. Huang, B., Hwang, H.S. and Lee, N.C. (2007), "A compliant and creep resistant SAC-Al(Ni) alloy", IEEE Proceedings of Electronic Components and Technology Conference, ECTC 57th, Reno, NV, 29 May-1 June, pp. 184-191
15. Hutter, M., Schmidt, R., Zerrer, P., Rauschenbach, S., Wittke, K., Scheel, W. and Reichl, H. (2009), "Effects of additional elements (Fe, Co, Al) on SnAgCu solder joints", IEEE Proceedings of Electronic Components and Technology Conference, ECTC 59th, San Diego, CA.
16. Kim, K.S., Huh, H. and Suganuma, K. (2003), "Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu", Microelectron. Reliab., Vol.43, pp. 259-267
17. Lee, W.W., Nguyen, L.T. and Selvaduray, G.S. (2000), "Solder joint fatigue models: review and applicability to chip scale packages", Microelectron. Reliab., Vol.40, pp. 231-244
18. Liang, J., Gollhardt, N., Lee, P.S., Schroeder, S.A. and Morris, W.L. (1996), "A study of fatigue and creep behaviour of four high temperature solders", Fatigue Fract. Eng. Mater. Struct., Vol.19, pp. 1401-1409
19. Lin, L.K., Hsiao, C.C. and Chen, K.I. (2002), "Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment", J. Mater. Res., Vol.17, pp. 2386-2393
20. McCormick, H., Snugovsky, P., Hamilton, C., Bagheri, Z. and Bagheri, S. (2006), "The great SAC debate: comparing the reliability of sac305 and sac405 solders in a variety of applications", SMTA International Conference Proceedings, Chigaco, IL.
21. Mango, M. (2005), "Lead-free electronic assembly for automotive application", Proceedings of European Microelectronics and Packaging Conference, EMPC 16th, Bruges, 12-15 June, pp. 451-456
22. Massalski, T.B. (1990), Binary Alloy Phase Diagrams, American Society for Metals, Metals Park, OH.
23. Moon, K.W., Boettinger, W.J., Kattner, U.R., Biancaniello, F.S. and Handwerker, C.A. (2000), "Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys", J. Electron. Mater., Vol.29, pp. 1122-1136
24. Nowottnick, M., Haertel, W., Wittke, K. and Detert, M. (2008), "Reaktionslote in der Elektronik - Erfahrungen und Potentiale", Plus, No.4, pp. 788-793
25. Patent (2008), Patent: AKZ 2008P10283DE-Metallstearat.
26. Schubert, A., Dudek, R., Auerswald, E., Gollhardt, A., Michel, B. and Reichl, H. (2003), "Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation", IEEE Proceedings of Electronic Components and Technology Conference, ECTC 53th, New Orleans, LA, pp. 603-610
27. Song, J.M., Huang, C.F. and Chuang, H.Y. (2006), "Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys", J. Electron. Mater., Vol.35, pp. 2154-2163
28. Swenson, D. (2007), "The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints", J. Mater. Sci. Mater. El., Vol.18, pp. 39-54.
29. Syed, A., Tae, S.K., Young, M.C., Chang, W.K. and Min, Y. (2006), "Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish", IEEE Proceedings of Electronics Packaging Technology Conference, EPTC 8th, Singapore, 6-8 December, pp. 404-411
30. Wittke, K., Scheel, W. and Nowottnick, M. (2001), "Pikometallurgie - ein Verfahren zur Verbesserung des Krichverhaltens von Weichlö tverbindungen", VTE Aufbau und Verbindungstechnik, Vol.13, pp. 293-304.
31. Wu, C.M.L., Yu, D.Q., Law, C.M.T. and Wang, L. (2002), "Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys", J. Electron. Mater., Vol.31, pp. 928-932
32. Zerrer, P., Fix, A., Hutter, M. and Pape, U. (2008), "NanoFlux - doping of solder paste", IEEE Proceedings of Electronics System integration Technology Conference, ESTC 2nd, London, pp. 923-927