Liquid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 687-690

  Liu, Xiaoying ^a   Zhao, Yanhui ^a   Huang, Mingliang ^a   Wu, C M L ^b   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; CU SUBSTRATE; INTERFACIAL MORPHOLOGIES; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; LIQUID STATE; SAC-SOLDERS; SMALL CRACK; SN-AG-CU; VOLUME PERCENTAGE;

BIOACTIVITY; CHIP SCALE PACKAGES; CRACKS; GROWTH KINETICS; IRON ALLOYS; LIQUIDS; PACKAGING; PHASE DIAGRAMS; PHASE INTERFACES; REACTION KINETICS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS;

TIN;

EID: 70449941563     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270662     Document Type: Conference Paper

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