Microstructural changes of lead-free solder joints during long-term ageing, thermal cycling and vibration fatigue

Soldering and Surface Mount Technology

Volumn 20, Issue 1, 2008, Pages 13-21

  Fix, Andreas R ^a   Nüchter, Wolfgang ^a   Wilde, Jürgen ^b,c  

^a ROBERT BOSCH GMBH   (Germany)

^b UNIVERSITY OF FREIBURG   (Germany)

^c Aufbau und Verbindungstechnik   (Germany)

Author keywords

Ageing (materials); Diffusion; Solder; Soldering; Thermal testing; Vibration

Indexed keywords

GROWTH KINETICS; LEAD COMPOUNDS; MICROSTRUCTURE; THERMAL CYCLING; VIBRATION ANALYSIS;

ISOTHERMAL STORAGE; LEAD-FREE SOLDER JOINTS; MICROSTRUCTURAL CHANGES; TRANSGRANULAR CRACKS;

SOLDERED JOINTS;

EID: 40249089984     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910810861440     Document Type: Article

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