Effect of alloying elements on the creep behavior of high Pb-based solders

Materials Science and Engineering: A

Volumn 528, Issue 3, 2011, Pages 1063-1070

  Schoeller, Harry ^a   Bansal, Shubhra ^b   Knobloch, Aaron ^b   Shaddock, David ^b   Cho, Junghyun ^a  

^a State University of New York at Binghamton   (United States)

^b GE GLOBAL RESEARCH   (United States)

Author keywords

Activation energy; Creep; Dislocation; Pb; Power law; Solders

Indexed keywords

ALLOYING ELEMENTS; BINARY ALLOYS; CREEP; DIFFUSION; HIGH TEMPERATURE APPLICATIONS; LEAD ALLOYS; LEAD-FREE SOLDERS; SILVER ALLOYS; STRAIN RATE; TIN ALLOYS;

CREEP BEHAVIORS; DISLOCATION; DISLOCATION CLIMB; DISLOCATION CREEP; HIGH TEMPERATURE CREEP; PB; POWER-LAW; STRAIN-RATES; STRESS ACTIVATION; STRESS EXPONENTS;

ACTIVATION ENERGY;

EID: 78650175317     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.10.083     Document Type: Article

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