Mechanical properties of intermetallic compounds in the Au-Sn system

Journal of Materials Research

Volumn 20, Issue 8, 2005, Pages 2161-2172

  Chromik, R R ^a,b   Wang, D N ^a   Shugar, A ^a   Limata, L ^a   Notis, M R ^a   Vinci, R P ^a  

^a Lehigh University   (United States)

^b NAVAL RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CREEP; ELASTIC MODULI; GOLD ALLOYS; HARDNESS; INDENTATION; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; STIFFNESS;

CREEP RESISTANT; INDENTATION CREEP MEASUREMENTS; NANOINDENTATION;

INTERMETALLICS;

EID: 28844469419     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0269     Document Type: Article

References (51)

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