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Journal of Electronic Materials

Volumn 38, Issue 9, 2009, Pages 1855-1859

Constitutive relations of indium in extreme-temperature electronic packaging based on anand model

(2) Chang, Rui Wu a McCluskey, F Patrick a

a UNIVERSITY OF MARYLAND (United States)

Author keywords

Electronic packaging; Indium; Low temperature; Viscoplastic constitutive properties

Indexed keywords

ANAND MODEL; CONSTANT LOADS; CONSTITUTIVE RELATIONS; ELECTRONIC PACKAGING; INELASTIC DEFORMATION; ISOTHERMAL CONDITIONS; LOW TEMPERATURE; LOW TEMPERATURES; MATERIAL PARAMETER; TEMPERATURE DEPENDENT; TEST DATA; VISCOPLASTIC CONSTITUTIVE PROPERTIES;

ELECTRONICS PACKAGING;

INDIUM;

EID: 68949145971 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0765-8 Document Type: Article

Times cited : (49)

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