Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly

Journal of Electronic Materials

Volumn 35, Issue 10, 2006, Pages 1857-1865

  Nousiainen, O ^a   Putaala, J ^a   Kangasvieri, T ^a   Rautioaho, R ^a   Vahakangas J ^a  

^a UNIVERSITY OF OULU   (Finland)

Author keywords

90Pb10Sn sphere; Lead free solder; Reliability; Thermal cycling

Indexed keywords

CERAMIC MATERIALS; INTERMETALLICS; METALLIZING; METALLURGY; RELIABILITY; THERMAL CYCLING; THERMAL EFFECTS;

90PB10SN SPHERE; LEAD-FREE SOLDER; LOW TEMPERATURE CO-FIRED CERAMIC (LTCC); THERMAL FATIGUE;

SOLDERED JOINTS;

EID: 33750186083     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0168-z     Document Type: Article

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