Microstructural evolution of the Au-20 wt.% Sn solder on the Cu substrate during reflow

Journal of Alloys and Compounds

Volumn 485, Issue 1-2, 2009, Pages 219-224

  Chung, Hsang mou ^a   Chen, Chih ming ^a   Lin, Chi pu ^a   Chen, Chia ju ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Intermetallics; Precipitation; Surfaces and interfaces

Indexed keywords

COMPOSITE MICROSTRUCTURES; CU SUBSTRATE; DENDRITIC GROWTH; EUTECTIC MICROSTRUCTURE; FASTER RATES; LAMELLAR EUTECTIC; LAMELLAR MICROSTRUCTURE; PRECIPITATION; SOLDER JOINTS; SOLDER MATRIX; SURFACES AND INTERFACES; TWO PHASIS; VERTICAL SECTION;

DENDRIMERS; EUTECTICS; INTERMETALLICS; MICROSTRUCTURAL EVOLUTION; PHASE DIAGRAMS; PHASE INTERFACES; SOLDERING ALLOYS;

TIN;

EID: 72049108056     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.06.018     Document Type: Article

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