Isothermal aging characteristics of Sn-Pb micro solder bumps

Microelectronics Reliability

Volumn 43, Issue 5, 2003, Pages 757-763

  Kim, K S ^a   Yu, C H ^b   Kim, N H ^c   Kim, N K ^c   Chang, H J ^d   Chang, E G ^c  

^a Yeojoo Institute of Technology   (South Korea)

^b Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^c Chung Ang University   (South Korea)

^d Dankook University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; INTERFACES (MATERIALS); INTERMETALLICS; LEAD; MELTING; NICKEL; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; TIN; TRANSMISSION ELECTRON MICROSCOPY;

UNDER BUMP METALLURGY (UBM);

SOLDERING ALLOYS;

EID: 0038665275     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00060-X     Document Type: Article

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