Influences of Ag and Au additions on structure and tensile strength of Sn-5Sb lead free solder alloy

Journal of Materials Science and Technology

Volumn 24, Issue 6, 2008, Pages 921-925

  El Daly, A A ^a   Swilem, Y ^a   Hammad, A E ^a  

^a Zagazig University   (Egypt)

Author keywords

Lead free solder; Melting temperature; Sn Sb solder; Tensile strength

Indexed keywords

ALLOYS; BRAZING; CERIUM ALLOYS; DUCTILITY; INTERMETALLICS; LEAD; MELTING; MELTING POINT; METAL MELTING; METALLIC COMPOUNDS; MICROSTRUCTURE; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN RATE; STRENGTH OF MATERIALS; TENSILE STRENGTH; TENSILE TESTING; TIN ALLOYS; WELDING; YIELD STRESS;

ELECTRONIC APPLICATIONS; FUSION HEATS; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER; MELTING TEMPERATURE; MICROSTRUCTURE STABILITIES; SN-SB SOLDER; SOLDER ALLOYS; SOLIDIFICATION MICROSTRUCTURES; TENSILE TESTS; ULTIMATE TENSILE STRENGTHS;

TIN;

EID: 57749090393     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (24)

1. N. Wade, K. Wu, J. Kunii, S. Yamada and K. Miyahara: J. Electron. Mater., 2001, 30, 1228.
2. M. D. Mathew, H. Yang, S. Movva and K. L. Murty: Metall. Mater. Trans. A, 2005, 36, 99.
3. F. Ochoa, X. Deng and N. Chawala: J. Electron. Mater., 2004, 33, 1596.
4. R. A. Islam, B. Y. Wu, M. O. Alam, Y. C. Chan and W. Jillek: J. Alloy. Compd., 2005, 392, 149.
5. R. Mahmudi, A. R. Geranmayeh, M. Bakherad and M. Allami: Mater. Sci. Eng. A, 2007, 457, (1-2), 173.
6. A. A. El-Daly: Phys. Status Solidi A, 2004, 201, 2035.
7. A. A. El-Daly and A. M. Abdel Daim: Phys. Status Solidi A, 2003, 198, 56.
8. J. Rodney, R. J. McCabe and M. E. Fine: Metall. Mater. Trans. A, 2002, 33, 1531.
9. Abu Bakr El-Bediwi: Cryst. Res. Technol., 2005, 40, 688.
10. J. Yang, M. Wachtler, M. Winter and J. O. Besebhard: Electrochem. Solid State Lett., 1999, 2, 161.
11. I. Rom, M. Wachtler, I. Papst, M. Schmied, J. O. Besenhard, F. Hofer and M. Winter: Solid State Ionics, 2001, 143, 329.
12. S. W. Chen, P. Y. Chen and C. H. Wang: J. Electron. Mater., 2006, 35, 1982.
13. C. E. Ho, R. Zheng, G. L. Luo, A. H. Lin and C. R. Kao: J. Electron. Mater., 2000, 29, 1175.
14. C. E. Ho, W. T. Chen and C. R. Kao: J. Electron. Mater., 2001, 37, 30.
15. M. M. El-Bahay, M. E. El-Mossalamy, M. Mahdy and A. A. Bahgat: Phys. Status Solidi A, 2003, 198, 76.
16. M. Hansen: Constitution of binary alloys, McGraw-Hill Book Co., New York, 1958, 232.
17. P. T. Vianco and J. A. Rejent: J. Electron. Mater., 1999, 28, 1127.
18. M. E. Brown: Introduction to thermal analysis, 3rd end, Wiley, New York, 1986, 33.
19. T. C. Chang, M. C. Wang and M. H. Hon: Mater. Trans., 2004, 45, 1.
20. M. H. Beshai, S. K. Habib, A. M. Yassein, G. Saad and M. M. Hasab El-Naby: Cryst. Res. Technol., 1999, 34, 119.
21. I. Shohji, T. Yoshhida, T. Takahashi and S. Hioki: J. Mater Sci., 2004, 15, 219.
22. T. H. Covrtney: Mechanical Behaviour of Materials, McGraw-Hill Book Co., New York, 1990.
23. C. K. Lin and D. Y. Chu: J. Mater. Sci., 2005, 16, 255.
24. R. J. McCabe and M. E. Fine: JOM-J. Min. Met. Mat. S., 2000, 52, 33.