Room-temperature indentation creep of lead-free Sn-5%Sb solder alloy

Journal of Electronic Materials

Volumn 34, Issue 7, 2005, Pages 1002-1009

  Geranmayeh, A R ^a   Mahmudi, R ^b  

^a ISLAMIC AZAD UNIVERSITY   (Iran)

^b UNIVERSITY OF TEHRAN   (Iran)

Author keywords

Creep; Indentation; Lead free solder; Stress exponent

Indexed keywords

CREEP; DISLOCATIONS (CRYSTALS); GRAIN SIZE AND SHAPE; INDENTATION; STRAIN RATE; STRESS ANALYSIS; VICKERS HARDNESS TESTING; X RAY DIFFRACTION ANALYSIS;

HOMOGENIZED WROUGHT (HW); LEAD-FREE SOLDERS; STRESS EXPONENT; UNHOMOGENIZED CAST (UC);

SOLDERING ALLOYS;

EID: 23244439423     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0087-4     Document Type: Article

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