Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu

Materials Science and Engineering: A

Volumn 528, Issue 3, 2011, Pages 1055-1062

  El Daly, A A ^a   Mohamad, A Z ^a   Fawzy, A ^b   El Taher, A M ^a  

^a Zagazig University   (Egypt)

^b Ain Shams University   (Egypt)

Author keywords

61.66.Dk; 61.82.Bg; 62.20.Fe; Lead free solder; Mechanical properties; Microstructure; Sn Sb alloy

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; CREEP; CREEP RESISTANCE; ELECTRONICS PACKAGING; GRAIN REFINEMENT; LEAD ALLOYS; LEAD-FREE SOLDERS; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERED JOINTS; TENSILE TESTING; TIN ALLOYS;

61.66.; 61.82.; 62.20.; BG; CREEP BEHAVIORS; CREEP PROPERTIES; DK; FE; INTERMETALLICS COMPOUNDS; SOLDER ALLOYS;

MICROSTRUCTURE;

EID: 78650173150     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.11.001     Document Type: Article

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