Microstructural evolution of Sn-rich Au-Sn/Ni flip-chip solder joints under high temperature storage testing conditions

Scripta Materialia

Volumn 56, Issue 8, 2007, Pages 661-664

  Yoon, Jeong Won ^a   Chun, Hyun Suk ^a   Koo, Ja Myeong ^a   Lee, Hoo Jeong ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Electroplating; Flip chip; Packaging; Solder

Indexed keywords

AGING OF MATERIALS; ELECTRONICS PACKAGING; ELECTROPLATING; FLIP CHIP DEVICES; HIGH TEMPERATURE OPERATIONS; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; TIN ALLOYS;

HIGH TEMPERATURE STORAGE TESTING; MICROSTRUCTURAL EVOLUTION; SOLDER MATRIX;

SOLDERED JOINTS;

EID: 33846839370     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.12.031     Document Type: Article

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