SCOPUS 정보 검색 플랫폼

Journal of Alloys and Compounds

Volumn 509, Issue 25, 2011, Pages 7152-7161

Interfacial microstructure and properties of Sn-0.7Cu-0.05Ni/Cu solder joint with rare earth Nd addition

(6) Zeng, Guang a Xue, Songbai a Gao, Lili a Zhang, Liang a Hu, Yuhua a Lai, Zhongmin b

a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS (China)

b JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY (China)

Author keywords

Mechanical property; Metals; Microstructure

Indexed keywords

INTERFACIAL INTERMETALLICS; INTERFACIAL MICROSTRUCTURE; INTERFACIAL MORPHOLOGIES; ND ADDITION; SN WHISKER; SOLDER JOINTS; SOLDERABILITY; SPONGELIKE STRUCTURE; TRACE AMOUNTS;

INTERMETALLICS; MECHANICAL PROPERTIES; MICROSTRUCTURE; MORPHOLOGY; NEODYMIUM; NEODYMIUM ALLOYS; RARE EARTH ADDITIONS; RARE EARTHS; TENSILE STRENGTH;

TIN;

EID: 79956366632 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2011.04.037 Document Type: Article

Times cited : (36)

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