Liquid-state interfacial reaction of Sn-10Sb-5Cu high temperature lead-free solder and Cu substrate

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Zeng, Qiulian ^a,b   Guo, Jianjun ^a   Gu, Xiaolong ^a   Zhao, Xinbing ^b  

^a Zhejiang Metallurgical Research Institute   (China)

^b ZHEJIANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; BRAZING; CHIP SCALE PACKAGES; COPPER; COPPER ALLOYS; DISSOLUTION; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; LEAD; MELTING POINT; METAL RECOVERY; METALLIC COMPOUNDS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; TECHNOLOGY; TIN ALLOYS; WELDING;

BULK SOLDERS; CU SUBSTRATES; ELECTRON PROBE MICROSCOPY; ELECTRONIC PACKAGING; ENERGY DISPERSIVE X RAYS; HIGH MELTING; HIGH TEMPERATURE; HIGH-DENSITY PACKAGING; INTERFACIAL REACTION PRODUCTS; INTERFACIAL REACTIONS; INTERNATIONAL CONFERENCES; LEAD-FREE; LEAD-FREE SOLDER; LEAD-FREE SOLDERING; LIQUID STATES; PB SOLDERS; REACTION TEMPERATURES; REACTION TIME; SOLDER JOINTS; SOLDERING PROCESSES;

TIN;

EID: 52449113496     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4607093     Document Type: Conference Paper

References (13)

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