SCOPUS 정보 검색 플랫폼

Journal of Alloys and Compounds

Volumn 509, Issue 8, 2011, Pages 3509-3514

Interfacial reactions between high-Pb solders and Ag

(5) Lin, Chi Pu a Chen, Chih Ming a Yen, Yee Wen b Wu, Hsin Jay c Chen, Sinn Wen c

a NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

b NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY (Taiwan)

c NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Diffusion; Intermetallics; Liquid solid reactions; Metals and alloys; Microstructure

Indexed keywords

CU LAYERS; INITIAL STAGES; INTERFACIAL REACTIONS; ISOTHERMAL SECTIONS; LIQUID-SOLID REACTIONS; METALS AND ALLOYS; PB SOLDERS; PHASE TRANSFORMATION; SN CONCENTRATION; SOLDER COMPOSITION;

GRAIN BOUNDARIES; INTERMETALLICS; LEAD; LIQUIDS; METALLURGY; MICROSTRUCTURE; REACTION PRODUCTS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 79551479818 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2010.12.135 Document Type: Article

Times cited : (22)

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