Interfacial reactions and mechanical properties of In-48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows

Journal of Materials Research

Volumn 23, Issue 6, 2008, Pages 1631-1641

  Koo, Ja Myeong ^a   Yoon, Jeong Won ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; ATOMIC EMISSION SPECTROSCOPY; ATOMIC SPECTROSCOPY; BALL GRID ARRAYS; BRAZING; COPPER PLATING; ELECTRIC CURRENTS; ELECTROCHEMISTRY; ELECTROPLATING; EMISSION SPECTROSCOPY; GOLD ALLOYS; IMAGING TECHNIQUES; INDUCTIVELY COUPLED PLASMA; INTERFACIAL ENERGY; INTERMETALLICS; MECHANICAL PROPERTIES; METALS; MOLECULAR SPECTROSCOPY; PHOTORESISTS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; SPECTROSCOPY; SUBSTRATES; TIN ALLOYS; WELDING;

BALL GRID ARRAY (BGA); ELECTRON MICROSCOPY , TRANSMISSION; ENERGY DISPERSIVE X RAY SPECTROMETRY (EDXS); INDUCTIVELY COUPLED PLASMA-ATOMIC EMISSION SPECTROSCOPY (ICP-AES); INTERFACIAL REACTIONS; INTERMETALLIC COMPOUND (IMC); SHEAR PROPERTIES; SOLDER JOINTS; X-RAY DIFFRACTOMETRY (XRD);

TIN;

EID: 48949117368     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0223     Document Type: Article

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