Toward five-dimensional scaling: How density improves efficiency in future computers

IBM Journal of Research and Development

Volumn 55, Issue 5, 2011, Pages

  Ruch, P ^a   Brunschwiler, T ^a   Escher, W ^a   Paredes, S ^a   Michel, B ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

2D-ARRAYS; 3D ARCHITECTURES; ALLOMETRIC SCALING; ARCHITECTURAL CONCEPTS; BIOLOGICAL EFFICIENCY; BRAIN-INSPIRED; ELECTRICAL POWER SUPPLY; ELECTROCHEMICAL POWER; ENERGETIC CHEMICALS; HUMAN BRAIN; INTEGRATION DENSITY; LOGIC ELEMENTS; LOW-COMPLEXITY; MULTIPLE LAYERS; POWER DELIVERY; SUPPLY NETWORKS; VERTICAL INTEGRATION;

CHEMICAL COMPOUNDS; CHIP SCALE PACKAGES; COMMUNICATION; COMPUTER ARCHITECTURE; COOLING; DATA PROCESSING; EFFICIENCY; ELECTRIC POWER TRANSMISSION; INTEGRATION; PACKAGING; POWER QUALITY; THREE DIMENSIONAL;

TELECOMMUNICATION SYSTEMS;

EID: 81555212598     PISSN: 00188646     EISSN: 21518556     Source Type: Journal    
DOI: 10.1147/JRD.2011.2165677     Document Type: Article

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