A novel high performance, ultra thin heat sink for electronics

International Journal of Heat and Fluid Flow

Volumn 31, Issue 4, 2010, Pages 586-598

  Escher, W ^a,b   Michel, B ^a   Poulikakos, D ^b  

^a IBM RESEARCH ZURICH   (Switzerland)

^b ETH ZURICH   (Switzerland)

Author keywords

Electronics cooling; Heat transfer; Impinging jet; Manifold; Micro channels

Indexed keywords

COMPLETE SYSTEM; COMPUTATIONAL TIME; ELECTRONICS COOLING; FLUID DISTRIBUTION; GEOMETRIC PARAMETER; HEAT TRANSFER STRUCTURES; IMPINGING JET; MAXIMUM COOLING CAPACITY; NUMERICAL MODELS; ROBUST OPTIMIZATION; SEMIEMPIRICAL MODELS; TEMPERATURE DIFFERENCES; THERMAL PERFORMANCE; THERMAL RESISTANCE; THREE-DIMENSIONAL NUMERICAL MODELS; ULTRA-THIN;

COOLING; DIELECTRIC PROPERTIES; FLUID DYNAMICS; HEAT SINKS; HYDRODYNAMICS; NUMERICAL METHODS; OPTIMIZATION;

THREE DIMENSIONAL;

EID: 77953618263     PISSN: 0142727X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatfluidflow.2010.03.001     Document Type: Article

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