Microminiature packaging and integrated circuitry: The work of E. F. Rent, with an application to on-chip interconnection requirements

IBM Journal of Research and Development

Volumn 49, Issue 4-5, 2005, Pages 777-803

  Lanzerotti, Mary Yvonne ^a   Fiorenza, Giovanni ^a   Rand, Rick A ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER HARDWARE; COMPUTER SYSTEMS; DATA PROCESSING; LOGIC CIRCUITS; MICROPROCESSOR CHIPS; ULSI CIRCUITS;

MICROMINIATURE PACKAGING; ON-CHIP INTERCONNECTION;

CHIP SCALE PACKAGES;

EID: 25844451118     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.494.0777     Document Type: Review

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