Thermal issues in next-generation integrated circuits

IEEE Transactions on Device and Materials Reliability

Volumn 4, Issue 4, 2004, Pages 709-714

  Gurrum, Siva P ^a   Suman, Shivesh K ^a   Joshi, Yogendra K ^a   Fedorov, Andrei G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Chip centric cooling; Chip to ambient thermal resistance; Electronic cooling; International Technology Roadmap for Semiconductors (ITRS)

Indexed keywords

COOLING; COSTS; CURRENT DENSITY; ELECTRIC CURRENTS; HEAT LOSSES; HEAT RESISTANCE; MICROPROCESSOR CHIPS; SILICA;

CHIP-CENTRIC COOLING; CHIP-TO-AMBIENT THERMAL RESISTANCE; ELECTRONIC COOLING; INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS (ITRS);

INTEGRATED CIRCUITS;

EID: 13444310690     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2004.840160     Document Type: Article

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