Direct waste heat utilization from liquid-cooled supercomputers

2010 14th International Heat Transfer Conference, IHTC 14

Volumn 8, Issue , 2010, Pages 429-440

  Brunschwiler, Thomas ^a   Meijer, Gerhard Ingmar ^a   Paredes, Stephan ^a   Escher, Werner ^a   Michel, Bruno ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION COOLING; ALTERNATIVE ENERGY; CARBON DIOXIDE EMISSIONS; CHIP STACKING; COLD CLIMATE; COMBUSTION PRO-CESS; COOLANT TEMPERATURE; DATA CENTERS; DOUBLE SIDED; EFFECTIVE ENERGY; EFFICIENCY GAIN; HEAT SOURCES; HOT CLIMATE; HOT SPOT; HOT WATER; MICRO-SCALES; PUMPING POWER; WINTER SEASONS;

ADSORPTION; CARBON FOOTPRINT; COOLING SYSTEMS; DESALINATION; GLOBAL WARMING; HEAT TRANSFER; SUPERCOMPUTERS; THERMOGRAPHY (TEMPERATURE MEASUREMENT); WATER FILTRATION;

LIQUIDS;

EID: 81555197280     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IHTC14-23352     Document Type: Conference Paper

References (47)

1. Koomey, J.G., Estimating total power consumption by servers in the U.S. and in the world, http://www.koomey.com, February 15, 2007 Lawrence Berkeley National Laboratory and Stanford University.
2. Scaramella, J., "Worldwide Server Energy Expense 2009-2013 Forecast", Document #221346, IDC 2009.
3. Bell, M., "The Data Center Power and Cooling Challenge," The Gartner Group, December 1, 2006; see http://searchdatacenter.techtarget.com/ news/article/0,28914 2,sid80-gci1260874,00.html#.
4. Fichera, R., "Power and Cooling Heat Up the Data Center," Forrester, March 8, 2006; see http://www.forrester.com/Research/Document/ Excerpt/0,7 211,38746,00.html.
5. G. I. Meijer, "Cooling Energy-Hungry Data Centers," Science 328, 318 (2010).
6. Kaplan, J.M. et al., "Revolutionizing Data Center Energy Efficiency", McKinsey & Company, 2008.
7. Stern, N., "Stern Review on the Economics of Climate Change"; see http://www.hm-treasury.gov.uk/sternreview-index.htm.
8. th Assessment Report of the IPCC, Cambridge Univ. Press, Cambridge, ISBN 978 0521 70598-1.
9. Jackson, T., "Prosperity Without Growth: Economics for a Finite Planet", Earthscan, London, U.K. 2009.
10. The United Nations Framework Convention on Climate Change: Kyoto Treaty; see http://unfccc.int/essentialbackground/convention/items/2627.php.
11. Iyengar, M. and Schmidt, R., "Analytical Modeling for Thermodynamic Characterization of Data Center Cooling Systems", J. Electron. Packag. 131 (2), 021009-021018 (2009).
12. Green 500 list www.green500.org
13. Carey V.P. and Shah, A.H., "The exergy cost of information processing - a comparison of computer-based technologies and biological systems", Proc. ASME Intl. Mech. Eng. Congress Anaheim, CA, 1-9 (2004).
14. Meijer, G. I, Brunschwiler, T., Paredes, T., and Michel, B., "Using Waste Heat form Data Centres to Minimize Carbon Dioxide Emission", ERCIM News 79, 23-24 (2009).
15. Brunschwiler, T., Smith, B., Ruetsche, E., and Michel, B., "Toward zero-emission datacenters through direct reuse of thermal energy", IBM J. Res. Develop. 53(3), paper 11; see: http://www.research.ibm.com/journal/
16. Simons, R.E., "Electronics Cooling Applications", Electronics Cooling, May 1996.
17. Agonafer, D., Free, J.A., "Numerical Modeling of an entire Thermal Conduction Module using a thermal Coupling Methodology", ASME Intl. Mech. Eng. Congress 1-6 (1995).
18. Ellsworth, M.J., Campbell, L.A., Simons, R.E., Iyengar, M.K., Schmidt, R.R., and Chu, R.C., "The Evolution of Water Cooling for IBM Large Server Systems: Back to the Future", ITHERM 2008.
19. Brunschwiler, T., Kloter, U., Linderman, R., Rothuizen, H., and Michel, B., "Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance", IEEE Trans. Comp. Packag. Technol. 30(2), 226-234 (2007). (Pubitemid 46864850)
20. Linderman, R.J., Brunschwiler, T., Kloter, U., Toy, H., and Michel, B., "Hierarchical nested surface channels for reduced particle stacking and low resistance thermal interfaces", 23rd IEEE SEMI-THERM Symposium, March 20-22, 2007, San Jose, CA, USA.
21. Smith, B., Glatz, W., and Michel, B., "Mini-and microchannels in thermal interfaces: spatial, temporal, material, and practical significance", Electronics Cooling, Vol 15 (1), 2009. http://electronics- cooling.com/html/2009-feb-a2.php
22. st IEEE SEMI-THERM Symposium, 2005, San Jose, CA, USA.
23. Brunschwiler, T. et al., "Direct liquid jet-impingement cooling with micro-sized nozzle array and distributed return architecture", Proc. ITHERM 2006, San Diego, CA, 196-203 (2006). (Pubitemid 44929482)
24. Agostini, B., et al., "State-of-the-Art of High Heat Flux Cooling Technologies", Heat Transf. Eng., Vol. 28, No. 4, 258-281 (2007). (Pubitemid 46396021)
25. Agostini, B., et al., "High heat flux boiling in multi-microchannels-Part I-Part III", Intl. J. Heat and Mass Transfer 51 5400-5442 (2008).
26. Escher, W., Michel, B., and Poulikakos, D., 'Efficiency of optimized bifurcating tree-like and parallel microchannel networks in the cooling of electronics', Intl. J. of Heat and Mass Transf. 52 (2009) 1421-1430.
27. Escher, W. Brunschwiler, T., Michel, B., and Poulikakos, D., "Experimental Investigation of an Ultra-thin Manifold Micro-channel Heat Sink for Liquid-Cooled Chips", Intl. J. of Heat and Mass Transf., 2010, Under Review.
28. Escher, W., Michel B., and Poulikakos, D., "A Novel High Performance, Ultra Thin Heat Sink for Electronics", Intl. J. Heat and Fluid Flow, 2010, Under Review.
29. Brunschwiler, T., Michel, B. Rothuizen, H., Kloter, U., Wunderle, B. and Reichll, H., "Hotspot-Optimized Cooling in Vertically Integrated Packages", MRS
30. P.E. Garrou, P. Ramm and C.A. Bower, "3D Integration: Technology and Applications", Wiley, Berlin, (2008).
31. Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Cesar, W., Leblebici, Y., Wunderle, B., and Reichl, H., "Heat-Removal Performance Scaling of Interlayer Cooled Chip Stacks", ITHERM 2010, submitted.
32. Gaensslen, F.H. and Meyer, D.D., "Liquid nitrogen CMOS for computer applications", Proc. ICCD-91, Cambridge, MA, USA, 1991.
33. Jain, A. and Ramanathan, S., "Theoretical investigation of sub-ambient on-chip microprocessor cooling", Proc. ITHERM 2006, San Diego, CA (2006).
34. Colgan E.G. et al., "High performance and sub-ambient microchannel cooling", Proc. Fourth Intl. Conf. Nanochannels, Microchannels, and Minichannels, June 19-21, 2006, Limerick, Ireland.
35. Green Grid http://www.thegreengrid.org/gg-content/TGG-Data-Center-Power- Efficiency-Metrics-PUE-and-DCiE.pdf
36. Mittelman, G., Mouchtar, O., and Dayan, A., "Large-Scale Solar Thermal Desalination Plants: A Review", Heat Transfer Eng. 28(11) 924-930 (2007). (Pubitemid 47171553)
37. Shih, H., "Evaluating the technologies of thermal desalination using low-grade heat", Desalination 182, 461-469 (2005). (Pubitemid 41671047)
38. Fan, Y., Luo, L., and Souyri, B., "Review of solar sorption refrigeration technologies: Development and applications", Renewable and Sustainable Energy Reviews 11, 1758-1775 (2007). (Pubitemid 46901120)
39. Wang, L.W., Wang, R.Z., and Oliveira, R.G., "A review on adsorption working pairs for refrigeration", Renewable and Sustainable Energy Reviews 13, 518-543 (2009).
40. Critoph, R.E., "Adsorption Refrigerators and Heat Pumps", in "Carbon Materials for Advanced Technologies", Burchell, T.D. Ed., Pergamon, Amsterdam (1999).
41. Goicochea, J.V., Madrid, M., and Amon, C., "Effects of Quantum Corrections and Isotope Scattering on Silicon Thermal Properties", 47, Leuven, Belgium, THERMIC 2009.
42. Schoen, P.A. E., Michel, B., Curioni, A., and Poulikakos, D., "Hydrogen-bond enhanced thermal energy transport at functionalized, hydrophobic and hydrophilic silica-water interfaces", Chem. Phys. Lett. 476, 271-276 (2009).
43. Hu, M., Goicochea, J.V., Michel, B., and Poulikakos, D., "Thermal rectification at water/functionalized silica interfaces", Appl. Phys. Lett. 95, 151903-05 (2009).
44. Hu, M., Goicochea, J.V., Michel, B., and Poulikakos, D., "Surface functionalization mechanisms of enhancing heat transfer at solid-liquid interfaces", Int. Heat Transf. Conf. 10 (2010).
45. Buongiorno, J, Venerus, DC, Prabhat, N., et al., "A benchmark study on the thermal conductivity of nanofluids", J. of Appl. Phys., 106 (9), 094312 (2009).
46. Escher, W., Brunschwiler, T., Shalkevich, N., Buergi, T., Michel, B., and Poulikakos, D., "On the Cooling of Electronics with Nanofluids", ASME J. Heat Transf., 2010, Under Review.
47. Engelstaedter, H., "Finding the Right Green IT Strategy Is a Great Challenge-The 'Going Green Impact Tool' Supports You," Smart Energy Strategies: Meeting the Climate Change Challenge, vdf Hochschulverlag an der ETH Zurich, 2008, pp. 48-49.