High-performance interconnects: An integration overview

Proceedings of the IEEE

Volumn 89, Issue 5, 2001, Pages 586-601

  Havemann, H ^a,c   Hutchby, James A ^b  

^a TEXAS INSTRUMENTS   (United States)

^b NOVELLUS SYSTEMS INC   (United States)

^c SEMICONDUCTOR RESEARCH CORPORATION   (United States)

Author keywords

Aluminum metallization; Ball grid array (bga); Bandwidth; Bottom antireflection coating (barc); Chemical meclianical planarization (cmp); Code division multiple access; Coplanar waveguides; Copper metallization; Crosstalk; Diffusion barrier

Indexed keywords

EID: 33747557398     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/5.929646     Document Type: Article

References (42)

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