-
3
-
-
65849255850
-
32 nm half pitch formation with high numerical aperture single exposure
-
Feb
-
M. Jung, J.-M. Park, M. Kim, S. Hong, , J. Kim, I.-H. Park, and H.-K. Oh, "32 nm half pitch formation with high numerical aperture single exposure," in Proc. of SPIE, vol. 7274, Feb 2009.
-
(2009)
Proc. of SPIE
, vol.7274
-
-
Jung, M.1
Park, J.-M.2
Kim, M.3
Hong, S.4
Kim, J.5
Park, I.-H.6
Oh, H.-K.7
-
4
-
-
67149116525
-
MAPPER: High-throughput maskless lithography
-
Feb
-
M. J. Wieland, G. de Boer, G. F. ten Berge, R. Jager, T. van de Peut, J. J. M. Peijster, E. Slot, S. W. H. K. Steenbrink, T. F. Teepen, A. H. V. van Veen, , and B. J. Kampherbeek, "MAPPER: high-throughput maskless lithography," in Proc. of SPIE, vol. 7271, Feb 2009.
-
(2009)
Proc. of SPIE
, vol.7271
-
-
Wieland, M.J.1
de Boer, G.2
ten Berge, G.F.3
Jager, R.4
van de Peut, T.5
Peijster, J.J.M.6
Slot, E.7
Steenbrink, S.W.H.K.8
Teepen, T.F.9
van Veen, A.H.V.10
Kampherbeek, B.J.11
-
5
-
-
77949343678
-
Successors of ArF Water-Immersion Lithography: EUV Lithography, Multi-e-beam Maskless Lithography, or Nanoimprint?
-
Dec
-
B. J. Lin, "Successors of ArF Water-Immersion Lithography: EUV Lithography, Multi-e-beam Maskless Lithography, or Nanoimprint?" in J Micro/Nanolith. MEMS MOEMS, vol. 7, Dec 2008.
-
(2008)
J Micro/Nanolith. MEMS MOEMS
, vol.7
-
-
Lin, B.J.1
-
6
-
-
65849248744
-
Integration of EUV lithography in the fabrication of 22-nm node devices
-
Feb
-
O. Wood, C.-S. Koay, K. Petrillo, H. Mizuno, and S. Raghunathan, "Integration of EUV lithography in the fabrication of 22-nm node devices," in Proc. of SPIE, vol. 7271, Feb 2009.
-
(2009)
Proc. of SPIE
, vol.7271
-
-
Wood, O.1
Koay, C.-S.2
Petrillo, K.3
Mizuno, H.4
Raghunathan, S.5
-
7
-
-
77949361981
-
-
M. Dusa, J. Finders, and S. Hsu, Double patterning lithography: The bridge between low k1 ArF and EUV, in mic, Feb 2008.
-
M. Dusa, J. Finders, and S. Hsu, "Double patterning lithography: The bridge between low k1 ArF and EUV," in mic, Feb 2008.
-
-
-
-
8
-
-
45449119111
-
Interactions of double patterning technology with wafer processing, OPC and design flows
-
Feb
-
K. Lucas, C. Cork, A. Miloslavsky, G. Luk-Pat, L. Barnes, J. Hapli, J. Lewellen, G. Rollins, V. Wiaux, and S. Verhaegen, "Interactions of double patterning technology with wafer processing, OPC and design flows," in Proc. of SPIE, vol. 6924, Feb 2008.
-
(2008)
Proc. of SPIE
, vol.6924
-
-
Lucas, K.1
Cork, C.2
Miloslavsky, A.3
Luk-Pat, G.4
Barnes, L.5
Hapli, J.6
Lewellen, J.7
Rollins, G.8
Wiaux, V.9
Verhaegen, S.10
-
9
-
-
65849148606
-
Advanced self-aligned double patterning development for sub-30-nm DRAM manufacturing
-
Feb
-
W. Shiu, H. J. Liu, J. S. Wu, T.-L. Tseng, C. T. Liao, C. M. Liao, J. Liu, and T. Wang, "Advanced self-aligned double patterning development for sub-30-nm DRAM manufacturing," in Proc. of SPIE, vol. 7274, Feb 2009.
-
(2009)
Proc. of SPIE
, vol.7274
-
-
Shiu, W.1
Liu, H.J.2
Wu, J.S.3
Tseng, T.-L.4
Liao, C.T.5
Liao, C.M.6
Liu, J.7
Wang, T.8
-
10
-
-
57849158474
-
Sources of Overlay Error in Double Patterning Integration Schemes
-
Feb
-
D. Laidler, P. Leray, K. D'have, and S. Cheng, "Sources of Overlay Error in Double Patterning Integration Schemes," in Proc. of SPIE, vol. 6922, Feb 2008.
-
(2008)
Proc. of SPIE
, vol.6922
-
-
Laidler, D.1
Leray, P.2
D'have, K.3
Cheng, S.4
-
11
-
-
77949352024
-
Alignment system and process optimization for improvement of double patterning overlay
-
Feb
-
W.-K. Ma, J.-H. Kang, C.-M. Lim, H.-S. Kim, S.-C. Moon, S. Lalbahadoersing, and S.-C. Oh, "Alignment system and process optimization for improvement of double patterning overlay," in Proc. of SPIE, vol. 6922, Feb 2008.
-
(2008)
Proc. of SPIE
, vol.6922
-
-
Ma, W.-K.1
Kang, J.-H.2
Lim, C.-M.3
Kim, H.-S.4
Moon, S.-C.5
Lalbahadoersing, S.6
Oh, S.-C.7
-
12
-
-
65849422556
-
Accurate in-resolution level overlay metrology for multi patterning lithography techniques
-
Feb
-
I. Englard, R. Piech, C. Masia, N. Hillel, L. Gershtein, D. Sofer, R. Peltinov, and O. Adan, "Accurate in-resolution level overlay metrology for multi patterning lithography techniques," in Proc. of SPIE, vol. 6922, Feb 2008.
-
(2008)
Proc. of SPIE
, vol.6922
-
-
Englard, I.1
Piech, R.2
Masia, C.3
Hillel, N.4
Gershtein, L.5
Sofer, D.6
Peltinov, R.7
Adan, O.8
-
13
-
-
57249086756
-
Optimization of high order control including overlay, alignment, and sampling
-
Feb
-
D. Choi, C. Lee, C. Bang, D. Cho, M. Gil, P. Izilson, S. Yoon, and D. Lee, "Optimization of high order control including overlay, alignment, and sampling," in Proc. of SPIE, vol. 6922, Feb 2008.
-
(2008)
Proc. of SPIE
, vol.6922
-
-
Choi, D.1
Lee, C.2
Bang, C.3
Cho, D.4
Gil, M.5
Izilson, P.6
Yoon, S.7
Lee, D.8
-
14
-
-
62449161477
-
Pattern Freezing Process Free Litho-Litho-Etch Double Patterning
-
Feb
-
T. Ando, M. Takeshita, R. Takasu, Y. Yoshii, J. Iwashita, S. Matsumaru, S. Abe, and T. Iwai, "Pattern Freezing Process Free Litho-Litho-Etch Double Patterning," in Proc. of SPIE, vol. 7140, Feb 2008.
-
(2008)
Proc. of SPIE
, vol.7140
-
-
Ando, T.1
Takeshita, M.2
Takasu, R.3
Yoshii, Y.4
Iwashita, J.5
Matsumaru, S.6
Abe, S.7
Iwai, T.8
-
15
-
-
65849518573
-
CD Uniformity improvement for Double-Patterning Lithography (Litho-Litho-Etch) Using Freezing Process
-
Feb
-
H. Sugimachi, H. Kosugi, T. Shibata, J. Kitano, K. Fujiwara, , , M. Mita, A. Soyano, S. Kusumoto, M. Shima, and Y. Yamaguchi, "CD Uniformity improvement for Double-Patterning Lithography (Litho-Litho-Etch) Using Freezing Process," in Proc. of SPIE, vol. 7273, Feb 2009.
-
(2009)
Proc. of SPIE
, vol.7273
-
-
Sugimachi, H.1
Kosugi, H.2
Shibata, T.3
Kitano, J.4
Fujiwara, K.5
Mita, M.6
Soyano, A.7
Kusumoto, S.8
Shima, M.9
Yamaguchi, Y.10
-
16
-
-
45449093398
-
Development of layout split algorithms and printability evaluation for double patterning technology
-
Feb
-
T.-B. Chiou, R. Socha, H. Chen, L. Chen, S. Hsu, P. Nikolsky, A. van Oosten, and A. C. Chen, "Development of layout split algorithms and printability evaluation for double patterning technology," in Proc. of SPIE, vol. 6924, Feb 2008.
-
(2008)
Proc. of SPIE
, vol.6924
-
-
Chiou, T.-B.1
Socha, R.2
Chen, H.3
Chen, L.4
Hsu, S.5
Nikolsky, P.6
van Oosten, A.7
Chen, A.C.8
-
17
-
-
35148859308
-
Pattern decomposition for double patterning from photomask viewpoint
-
Feb
-
N. Toyama, T. Adachi, Y. Inazuki, T. Sutou, Y. Morikawa, H. Mohri, and N. Hayashi, "Pattern decomposition for double patterning from photomask viewpoint," in Proc. of SPIE, vol. 6521, Feb 2007.
-
(2007)
Proc. of SPIE
, vol.6521
-
-
Toyama, N.1
Adachi, T.2
Inazuki, Y.3
Sutou, T.4
Morikawa, Y.5
Mohri, H.6
Hayashi, N.7
-
18
-
-
45449095473
-
Split and design guidelines for double patterning
-
Feb
-
V. Wiaux, S. Verhaegen, S. Cheng, F. Iwamoto, P. Jaenen, M. Maenhoudt, T. Matsuda, S. Postnikov, and G. Vandenberghe, "Split and design guidelines for double patterning," in Proc. of SPIE, vol. 6924, Feb 2008.
-
(2008)
Proc. of SPIE
, vol.6924
-
-
Wiaux, V.1
Verhaegen, S.2
Cheng, S.3
Iwamoto, F.4
Jaenen, P.5
Maenhoudt, M.6
Matsuda, T.7
Postnikov, S.8
Vandenberghe, G.9
-
21
-
-
70349152186
-
Double patterning layout decomposition for simultaneous conflict and stitch minimization
-
March
-
K. Yuan, J.-S. Yang, and D. Z. Pan, "Double patterning layout decomposition for simultaneous conflict and stitch minimization," in Proc. Int. Symp. on Physical Design, March 2009.
-
(2009)
Proc. Int. Symp. on Physical Design
-
-
Yuan, K.1
Yang, J.-S.2
Pan, D.Z.3
-
22
-
-
35148841978
-
Double pattern eda solutions for 32nm hp and beyond
-
Feb
-
G. Bailey, A. Tritchkov, J. Park, L. Hong, V. Wiaux, E. Hendrickx, S. Verhaegen, P. Xie, and J. Versluijs, "Double pattern eda solutions for 32nm hp and beyond," in Proc. of SPIE, vol. 6521, Feb 2007.
-
(2007)
Proc. of SPIE
, vol.6521
-
-
Bailey, G.1
Tritchkov, A.2
Park, J.3
Hong, L.4
Wiaux, V.5
Hendrickx, E.6
Verhaegen, S.7
Xie, P.8
Versluijs, J.9
-
23
-
-
45449093398
-
Development of layout split algorithms and printability evaluation for double patterning technology
-
March
-
T.-B. Chiou, R. Socha, H. Chen, L. Chen, S. Hsu, P. Nikolsky, A. van Oosten, and A. C. Chen, "Development of layout split algorithms and printability evaluation for double patterning technology," in Proc. of SPIE, March 2008.
-
(2008)
Proc. of SPIE
-
-
Chiou, T.-B.1
Socha, R.2
Chen, H.3
Chen, L.4
Hsu, S.5
Nikolsky, P.6
van Oosten, A.7
Chen, A.C.8
-
24
-
-
57849138456
-
Overlay Aware Interconnect and Timing Variation Modeling for Double Patterning Technology
-
Nov
-
J.-S. Yang and D. Z. Pan, "Overlay Aware Interconnect and Timing Variation Modeling for Double Patterning Technology," in Proc. Int. Conf. on Computer Aided Design, Nov 2008.
-
(2008)
Proc. Int. Conf. on Computer Aided Design
-
-
Yang, J.-S.1
Pan, D.Z.2
-
25
-
-
70350706638
-
Double patterning lithography friendly detailed routing with redundant via consideration
-
July
-
K. Yuan, K. Lu, and D. Z. Pan, "Double patterning lithography friendly detailed routing with redundant via consideration," in Proc. Design Automation Conf., July 2009.
-
(2009)
Proc. Design Automation Conf
-
-
Yuan, K.1
Lu, K.2
Pan, D.Z.3
-
26
-
-
64549144167
-
Timing Analysis and Optimization Implications of Bimodel CD Distribution in Double Patterning Lithography
-
K. Jeong and A. Kahng, "Timing Analysis and Optimization Implications of Bimodel CD Distribution in Double Patterning Lithography," in Proc. Asia and South Pacific Design Automation Conference, 2009.
-
(2009)
Proc. Asia and South Pacific Design Automation Conference
-
-
Jeong, K.1
Kahng, A.2
-
27
-
-
65849528344
-
Gridded design rule scaling: Taking the CPU toward the 16nm node
-
Feb
-
C. Bencher, H. Dai, and Y. Chen, "Gridded design rule scaling: taking the CPU toward the 16nm node," in Proc. of SPIE, vol. 7274, Feb 2009.
-
(2009)
Proc. of SPIE
, vol.7274
-
-
Bencher, C.1
Dai, H.2
Chen, Y.3
-
28
-
-
43249083986
-
APF pitch-halving for 22nm logic cells using gridded design rules
-
Feb
-
M. C. Smayling, C. Bencher, H. D. Chen, H. Dai, and M. P. Duane, "APF pitch-halving for 22nm logic cells using gridded design rules," in Proc. of SPIE, vol. 6925, Feb 2008.
-
(2008)
Proc. of SPIE
, vol.6925
-
-
Smayling, M.C.1
Bencher, C.2
Chen, H.D.3
Dai, H.4
Duane, M.P.5
-
29
-
-
45449087528
-
A new OPC method for double patterning technology
-
Feb
-
Y. Pan, H. Zhang, and Y. Chen, "A new OPC method for double patterning technology," in Proc. of SPIE, vol. 6924, Feb 2008.
-
(2008)
Proc. of SPIE
, vol.6924
-
-
Pan, Y.1
Zhang, H.2
Chen, Y.3
-
30
-
-
65849094540
-
-
M. Gheith, L. Hong, and J. Word, OPC for reduced process sensitivity in the double patterning flow, in Proc. of SPIE, 7274, Feb 2009.
-
M. Gheith, L. Hong, and J. Word, "OPC for reduced process sensitivity in the double patterning flow," in Proc. of SPIE, vol. 7274, Feb 2009.
-
-
-
-
31
-
-
65849338169
-
Double- patterning-friendly OPC
-
Feb
-
X. Li, G. Luk-Pat, C. Cork, L. Barnes, and K. Lucas, "Double- patterning-friendly OPC," in Proc. of SPIE, vol. 7274, Feb 2009.
-
(2009)
Proc. of SPIE
, vol.7274
-
-
Li, X.1
Luk-Pat, G.2
Cork, C.3
Barnes, L.4
Lucas, K.5
-
32
-
-
65849275915
-
Split, overlap/stitching, and process design for double patterning considering local reflectivity variation by using rigorous 3D wafer-topography/lithography simulation
-
Feb
-
I. Kamohara and T. Schmoeller, "Split, overlap/stitching, and process design for double patterning considering local reflectivity variation by using rigorous 3D wafer-topography/lithography simulation," in Proc. of SPIE, vol. 7274, Feb 2009.
-
(2009)
Proc. of SPIE
, vol.7274
-
-
Kamohara, I.1
Schmoeller, T.2
-
33
-
-
65849507051
-
Through-focus pattern matching applied to double patterning
-
Feb
-
J. Rubinstein and A. R. Neureuther, "Through-focus pattern matching applied to double patterning," in Proc. of SPIE, vol. 7274, Feb 2009.
-
(2009)
Proc. of SPIE
, vol.7274
-
-
Rubinstein, J.1
Neureuther, A.R.2
-
34
-
-
65849393681
-
32nm and below logic patterning using optimized illumination and double patterning
-
Feb
-
M. C. Smayling and V. Axelrad, "32nm and below logic patterning using optimized illumination and double patterning," in Proc. of SPIE, vol. 7274, Feb 2009.
-
(2009)
Proc. of SPIE
, vol.7274
-
-
Smayling, M.C.1
Axelrad, V.2
|