Thermomechanical behavior and microstructural evolution of SiN x/Al bimaterial microcantilevers

Journal of Micromechanics and Microengineering

Volumn 19, Issue 8, 2009, Pages

  Lin, I Kuan ^a   Zhang, Xin ^a   Zhang, Yanhang ^a  

^a Boston University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPES; BI-LAYER; BI-MATERIAL; COMBINED EFFECT; FINITE ELEMENT ANALYSIS; GRAIN STRUCTURES; HEATING STAGE; HOLDING TEMPERATURES; IN-SITU; INTERFEROMETRIC MICROSCOPE; ISOTHERMAL HOLDING; ISOTHERMAL HOLDING TEMPERATURE; KIRCHHOFF PLATE THEORY; LATERAL DIRECTIONS; MAXIMUM TEMPERATURE; MICRO-CANTILEVERS; MICROCANTILEVER BEAMS; MICROELECTROMECHANICAL SYSTEMS; MICROSTRUCTURE EVOLUTIONS; PEAK TEMPERATURES; POWER LAW CREEP; ROOM TEMPERATURE; THERMO-MECHANICAL BEHAVIORS; THERMOELASTIC DEFORMATIONS; THERMOELASTIC REGIME;

ALUMINUM; ATOMIC FORCE MICROSCOPY; CHEMICAL SENSORS; CREEP; GRAIN GROWTH; GRAIN SIZE AND SHAPE; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURAL EVOLUTION; PHOTORESISTS; RESIDUAL STRESSES; SILICON NITRIDE; STRESS RELAXATION; SURFACE ROUGHNESS; THERMAL CYCLING; THERMOELASTICITY;

COMPOSITE MICROMECHANICS;

EID: 70350627421     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/8/085010     Document Type: Article

References (53)

1. Burns D M and Bright V M 1998 Development of microelectromechanical variable blaze gratings Sensors Actuators A 64 7-15
2. Senesac L R, Corbeil J L, Rajic S, Lavrik N V and Datskos P G 2003 IR imaging using uncooled microcantilever detectors Ultramicroscopy 97 451-8
3. Miller D C, Zhang W G and Bright V M 2001 Micromachined, flip-chip assembled, actuatable contacts for use in high density interconnection in electronics packaging Sensors Actuators A 89 76-87
4. Lee S, Wallis T M, Moreland J, Kabos P and Lee Y C 2007 Asymmetric dielectric trilayer cantilever probe for calorimetric high-frequency field imaging J. Microelectromech. Syst. 16 78-86
5. Chang C L and Chang P Z 2000 Innovative micromachined microwave switch with very low insertion loss Sensors Actuators A 79 71-5
6. Bell P, Hoivik N, Bright V and Popovic Z 2003 A frequency tunable half-wave resonator using a MEMS variable capacitor Microelectron. Int. 20 21-5
7. Raiteri R, Grattarola M, Butt H J and Skladal P 2001 Micromechanical cantilever-based biosensors Sensors Actuators B 79 115-26
8. Baselt D R, Fruhberger B, Klaassen E, Cemalovic S, Britton C L, Patel S V, Mlsna T E, McCorkle D and Warmack B 2003 Design and performance of a microcantilever-based hydrogen sensor Sensors Actuators B 88 120-31
9. Riethmuller W and Benecke W 1988 Thermally excited silicon microactuators IEEE Trans. Electron Devices 35 758-63
10. Dai C L, Yen K S and Chang P Z 2001 Applied electrostatic parallelogram actuators for microwave switches using the standard CMOS process J. Micromech. Microeng. 11 697-702
11. Amantea R, Goodman L A, Pantuso F, Sauer D J, Varghese M, Villani T S and White L K 1998 Progress towards an uncooled IR imager with 5 mK NETD Proc. SPIE 3436 647-59
12. Grbovic D, Lavrik N V, Datskos P G, Forrai D, Nelson E, Devitt J and McIntyre B 2006 Uncooled infrared imaging using bimaterial microcantilever arrays Appl. Phys. Lett. 89 073118
13. Zhao Y, Mao M Y, Horowitz R, Majumdar A, Varesi J, Norton P and Kitching J 2002 Optomechanical uncooled infrared imaging system: design, microfabrication, and performance J. Microelectromech. Syst. 11 136-46
14. Miao Z Y, Zhang Q C, Chen D P, Guo Z Y, Dong F L, Xiong Z M, Wu X P, Li C B and Jiao B B 2007 Uncooled IR imaging using optomechanical detectors Ultramicroscopy 107 610-6
15. Datskos P G, Lavrik N V and Rajic S 2004 Performance of uncooled microcantilever thermal detectors Rev. Sci. Instrum. 75 1134-48
16. Hunter S R, Maurer G, Jiang L and Simelgor G 2006 High-sensitivity uncooled microcantilever infrared imaging arrays Proc. SPIE 6206 62061J
17. Li B 2004 Design and simulation of an uncooled double-cantilever microbolometer with the potential for similar to mK NETD Sensors Actuators A 112 351-9
18. Huang S S, Li B and Zhang X 2006 Elimination of stress-induced curvature in microcantilever infrared focal plane arrays Sensors Actuators A 130 331-9
19. Rogalski A 2003 Infrared detectors: status and trends Prog. Quantum Electron. 27 59-210
20. Dong F L, Zhang Q C, Chen D P, Pan L, Guo Z Y, Wang W B, Duan Z H and Wu X P 2007 An uncooled optically readable infrared imaging detector Sensors Actuators A 133 236-42
21. Gall K, Dunn M L, Zhang Y H and Corff B A 2004 Thermal cycling response of layered gold/polysilicon MEMS structures Mech. Mater. 36 45-55
22. Zhang X, Chen K S, Ghodssi R, Ayon A A and Spearing S M 2001 Residual stress and fracture in thick tetraethylorthosilicate (TEOS) and silane-based PECVD oxide films Sensors Actuators A 91 373-80
23. Lu J 1996 Handbook of Measurement of Residual Stresses (Lilburn, GA: Fairmount Press)
24. Chen K S, Chen T Y F, Chuang C C and Lin I K 2004 Full-field wafer level thin film stress measurement by phase-stepping shadow Moire IEEE Trans. Compon. Packag. Technol. 27 594-601
25. Lin I K, Zhang Y H and Zhang X 2008 The deformation of microcantilever-based infrared detectors during thermal cycling J. Micromech. Microeng. 18 075012
26. Bifano T G, Johnson H T, Bierden P and Mali R K 2002 Elimination of stress-induced curvature in thin-film structures J. Micromech. Microeng. 11 592-7
27. Miller D C, Dunn M L and Bright V M 2001 Thermally induced change in deformation of multimorph MEMS structures Proc. SPIE 4558 32-44
28. Huang S, Tao H, Lin I K and Zhang X 2008 Development of double-cantilever infrared detectors: Fabrication, curvature control and demonstration of thermal detection Sensors Actuators A 145 231-40
29. Lai J, Perazzo T, Shi Z and Majumdar A 1997 Optimization and performance of high-resolution micro-optomechanical thermal sensors Sensors Actuators A 58 113-9
30. Bagolini A, Pakula L, Scholtes T L M, Pham H T M, French P J and Sarro P M 2002 Polyimide sacrificial layer and novel materials for post-processing surface micromachining J. Micromech. Microeng. 12 385-9
31. HD Microsystems Inc 2000 PI2620 Data Sheet
32. Williams K R, Gupta K and Wasilik M 2003 Etch rates for micromachining processing: II J. Microelectromech. Syst 12 761-78
33. Instec Inc HCP302-STC200 Data Sheet
34. Degroot P and Deck L 1993 3-dimensional imaging by sub-Nyquist sampling of white-light interferograms Opt. Lett. 18 1462-4
35. Dunn M L, Zhang Y H and Bright V M 2002 Deformation and structural stability of layered plate microstructures subjected to thermal loading J. Microelectromech. Syst. 11 372-84
36. Hibbit, Karlsson & Sorensen, Inc 1998 ABAQUS User Manual
37. Shackelford J F and Alexander W 2001 CRC materials Science and Engineering Handbook (Sound Parkway, NW: CRC Press)
38. Zhang Y H and Dunn M L 2003 Deformation of blanketed and patterned bilayer thin-film microstructures during post-release and cyclic thermal loading J. Microelectromech. Syst. 12 788-96
39. Zhang Y H and Dunn M L 2004 Geometric and material nonlinearity during the deformation of micron-scale thin-film bilayers subject to thermal loading J. Mech. Phys. Solids 52 2101-26
40. Vinci R P and Vlassak J J 1996 Mechanical behavior of thin films Ann. Rev. Mater. Sci. 26 431-62
41. Freund L B, Floro J A and Chason E 1999 Extensions of the Stoney formula for substrate curvature to configurations with thin substrates or large deformations Appl. Phys. Lett. 74 1987-9
42. Weiss D, Gao H and Arzt E 2001 Constrained diffusional creep in UHV-produced copper thin films Acta Mater. 49 2395-403 (Pubitemid 32621515)
43. Baker S P, Kretschmann A and Arzt E 2001 Thermomechanical behavior of different texture components in Cu thin films Acta Mater. 49 2145-60
44. Leung O S, Munkholm A, Brennan S and Nix W D 2000 A search for strain gradients in gold thin films on substrates using x-ray diffraction J. Appl. Phys. 88 1389-96
45. Keller R M, Baker S P and Arzt E 1999 Stress-temperature behavior of unpassivated thin copper films Acta Mater. 47 415-26
46. Vickers-Kirby D J, Kubena R L, Stratton F P, Joyce R J, Chang D T and Kim J 2000 Anelastic creep phenomena in thin metal plated cantilevers for MEMS Mater. Res. Soc. Symp. 657 EE2.5.1-EE2.5.6
47. 2 layered thin-films Acta Metall. Mater. 43 3915-26
48. Chaudhari P 1972 Grain growth and stress relief in thin films J. Vac. Sci. Technol. 9 520-2
49. Volkert C A, Alofs C F and Liefting J R 1994 Deformation mechanisms of Al films on oxidized Si wafers J. Mater. Res. 9 1147-55
50. Iwamura E, Ohnishi T and Yoshikawa K 1995 A study of hillock formation on Al-Ta alloy films for interconnections of TFT-LCDs Thin Solid Films 270 450-5
51. Onishi T, Iwamura E and Takagi K 1999 Morphology of sputter deposited Al alloy films Thin Solid Films 340 306-16
52. Hwang S J, Lee Y D, Park Y B, Lee J H, Jeong C O and Joo Y C 2006 In situ study of stress relaxation mechanisms of pure Al thin films during isothermal annealing Scr. Mater. 54 1841-6
53. Gall K, West N, Spark K, Dunn M L and Finch D S 2004 Creep of thin film Au on bimaterial Au/Si microcantilevers Acta Mater. 52 2133-46