Deformation and structural stability of layered plate microstructures subjected to thermal loading

Journal of Microelectromechanical Systems

Volumn 11, Issue 4, 2002, Pages 372-384

  Dunn, Martin L ^b   Zhang, Yanhang ^b   Bright, Victor M ^a,b  

^a IEEE

^b UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FINITE ELEMENT METHOD; MICROSTRUCTURE; POLYSILICON; STABILITY; THERMAL EXPANSION; THERMAL LOAD; THERMOELASTICITY;

LAYERED PLATE MICROSTRUCTURES;

MICROELECTROMECHANICAL DEVICES;

EID: 0036684785     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2002.800932     Document Type: Article

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