Micromachined, flip-chip assembled, actuatable contacts for use in high density interconnection in electronics packaging

Sensors and Actuators, A: Physical

Volumn 89, Issue 1-2, 2001, Pages 76-87

  Miller, David C ^a   Zhang, Wenge ^a   Bright, Victor M ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CANTILEVER BEAMS; ELECTRONICS PACKAGING; ELECTROSTATICS; FLIP CHIP DEVICES; MATHEMATICAL MODELS;

HIGH DENSITY INTERCONNECT; MICROCONNECTOR; MICRORELAY;

MICROELECTROMECHANICAL DEVICES;

EID: 0035281099     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(00)00548-3     Document Type: Article

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