Thermal cycling response of layered gold/polysilicon MEMS structures

Mechanics of Materials

Volumn 36, Issue 1-2, 2004, Pages 45-55

  Gall, Ken ^a   Dunn, Martin L ^a   Zhang, Yanhang ^a   Corff, Brian A ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GOLD; POLYSILICON; THERMAL CYCLING; THERMAL EXPANSION;

THERMAL FLUCTUATIONS;

MICROELECTROMECHANICAL DEVICES;

EID: 10744231496     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-6636(03)00030-9     Document Type: Conference Paper

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