Cool chips: Opportunities and implications for power and thermal management

IEEE Transactions on Electron Devices

Volumn 55, Issue 1, 2008, Pages 245-255

  Lin, Sheng Chih ^a   Banerjee, Kaustav ^a  

^a University of California   (United States)

Author keywords

Cooling; Integrated circuits; Performance; Power consumption; Thermal management

Indexed keywords

CMOS INTEGRATED CIRCUITS; COOLING; ELECTRIC POWER UTILIZATION; SILICON ON INSULATOR TECHNOLOGY; TEMPERATURE CONTROL; THERMAL GRADIENTS;

COOL CHIPS; ELECTROTHERMAL COUPLINGS; POWER MANAGEMENT;

MICROPROCESSOR CHIPS;

EID: 37749018435     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2007.911763     Document Type: Article

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