A self-consistent substrate thermal profile estimation technique for nanoscale ICs - Part II: Implementation and implications for power estimation and thermal management

IEEE Transactions on Electron Devices

Volumn 54, Issue 12, 2007, Pages 3351-3360

  Lin, Sheng Chih ^a   Chrysler, Greg ^b   Mahajan, Ravi ^b   De, Vivek K ^b   Banerjee, Kaustav ^a  

^a Santa Barbara   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Gradient analysis; Integrated circuits; Leakage; Performance; Performance evaluation; Power; Substrates; Temperature; Temperature gradient; Thermal analysis; Thermal management

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; MICROPROCESSOR CHIPS; SEMICONDUCTING SILICON; SUBSTRATES; TEMPERATURE CONTROL; TEMPERATURE DISTRIBUTION; THERMAL GRADIENTS; THERMOANALYSIS;

ELECTROTHERMAL COUPLINGS; NANOSCALE INTEGRATED CIRCUITS; THERMAL PROFILE ESTIMATION;

INTEGRATED CIRCUITS;

EID: 36849032227     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2007.909038     Document Type: Article

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