Thermal management of high power dissipation electronic packages: From air cooling to liquid cooling

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 620-625

  Zhang, H Y ^a   Pinjala, D ^a   Teo, Poi Siong ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHARACTERIZATION; CHIP SCALE PACKAGES; COOLING; DROPS; ELECTRIC LOSSES; ELECTRONICS PACKAGING; HEAT SINKS; INTERFACES (MATERIALS); LIQUIDS; PRESSURE DROP; THERMOANALYSIS;

CHARACTERIZATION STUDIES; HIGH-DENSITY SUBSTRATES; LIQUID COOLING TECHNOLOGY; OVERALL THERMAL RESISTANCE; SYSTEM THERMAL RESISTANCES; THERMAL INTERFACE MATERIALS; THERMAL MEASUREMENTS; VAPOR CHAMBER HEAT SINKS;

ELECTRONIC COOLING;

EID: 84954065886     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271593     Document Type: Conference Paper

References (12)

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