On-chip hot spot cooling using silicon thermoelectric microcoolers

Journal of Applied Physics

Volumn 102, Issue 3, 2007, Pages

  Wang, Peng ^a   Bar Cohen, Avram ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; ELECTRIC RESISTANCE; HEAT FLUX; MICROPROCESSOR CHIPS; THERMAL EFFECTS; THERMOELECTRIC EQUIPMENT;

ON-CHIP HOT SPOT COOLING; THERMOELECTRIC COOLING; THERMOELECTRIC HEATING;

MICROSTRUCTURE;

EID: 34548025127     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2761839     Document Type: Article

References (30)

1. iNEMI, Electronics Manufacturing Initiative Technology Roadmap, 2004 (http://www.nemi.org).
2. S. Sinha, P. K. Schelling, S. R. Phillpot, and K. E. Goodson, J. Appl. Phys. 97, 023702 (2002).
3. A. Watwe and R. Viswanath, Proceedings of Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition (InterPack'03), 2003 (unpublished), Paper No. 2003-35044.
4. B. Yang, P. Wang, and A. Bar-Cohen, Proceedings of the 56th Electronic Components and Technology Conference (ECTC-56), 2006 (unpublished), pp. 997-1002.
5. B. Yang, P. Wang, and A. Bar-Cohen, IEEE Trans. Compon. Packag. Technol. (in press).
6. P. Wang, A. Bar-Cohen, and B. Yang, Proceedings of Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition (InterPack'07), 2003 (unpublished), Paper No. IPACK2007-33798.
7. T. C. Harman, P. J. Taylor, M. P. Walsh, and B. E. LaForge, Science 297, 2229 (2002).
8. R. Venkatasubramanian, E. Siivola, T. Colpitts, and B. O'Quinn, Nature (London) 413, 597 (2001).
9. X. Fan, G. Zeng, C. LaBounty, J. Bowers, E. Croke, C. Ahn, S. Huxtable, and A. Majumdar, Appl. Phys. Lett. 78, 1580 (2002).
10. G. Chen, IEEE Trans. Compon. Packag. Technol. 29A, 238 (2006).
11. R. Prasher, Intel Technol. J. 9, 285 (2005).
12. P. Wang, A. Bar-Cohen, and B. Yang, Proceedings of the 13th International Heat Transfer Conference (IHTC-13), 2006 (unpublished), Paper No. CND-09.
13. P. Wang and A. Bar-Cohen, Proceedings of Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition (InterPack'07), 2007 (unpublished), Paper No. IPACK2007-33940.
14. P. Wang, A. Bar-Cohen, B. Yang, and A. Shakouri, Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition (InterPack'05), 2005 (unpublished), Paper No. IPACK2005-73244.
15. P. Wang, A. Bar-Cohen, and B. Yang, J. Appl. Phys. 100, 14501 (2006).
16. P. Wang, A. Bar-Cohen, and B. Yang, Proceedings of ASME International Mechanical Engineering Congress & Exposition (IMECE'06), 2006 (unpublished), Paper No. IMECE2006-14383.
17. A. W. Herwaarden and P. M. Sarro, Sens. Actuators 10, 321 (1986).
18. T. H. Geballe and G. W. Hull, Phys. Rev. 98, 940 (1955).
19. Y. Zhang, A. Shakouri, and G. Zeng, Appl. Phys. Lett. 85, 2977 (2004).
20. D. R. Lide, CRC Handbook of Chemistry and Physics, 75th ed. (CRC, Boca Raton, FL, 1994).
21. A. D. Kraus and A. Bar-Cohen, Thermal Analysis and Control of Electronic Equipment (Hemisphere, New York, 1983).
22. Y. S. Muzychka, J. R. Culham, and M. M. Yovanovich, J. Electron. Packag. 125, 178 (2003).
23. R. Mahajan, R. Nair, V. Wakharkar, J. Tang, and G. Vandentop, Intel Technol. J. 6, 62 (2002).
24. C. A. Hewett, M. J. Taylor, J. R. Zeidler, and M. W. Geis, J. Appl. Phys. 77, 755 (1996).
25. A. N. Andreev, M. G. Rastegaeva, V. P. Rastegaeva, and S. A. Reshanov, Semiconductors 32, 739 (1998).
26. M. M. Yovanovich, J. Electron. Packag. 125, 169 (2003).
27. F. H. Horn, Phys. Rev. 97, 1521 (1955).
28. H. Fritzsche, Solid State Commun. 9, 1813 (1971).
29. C. Y. Chang, Y. K. Fang, and S. M. Sze, Solid-State Electron. 14, 541 (1971).
30. X. Fan, Ph.D. thesis, University of California at Santa Barbara, 2002.