Solid-state refrigeration for cooling microprocessors

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 1, 2006, Pages 179-183

  Ramanathan, Shriram ^a,b   Chrysler, Gregory M ^a  

^a INTEL CORPORATION   (United States)

^b HARVARD UNIVERSITY   (United States)

Author keywords

Figure of merit (ZT) values; Thin film thermoelectrics (TECs)

Indexed keywords

COMPUTATIONAL METHODS; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; HEAT CONDUCTION; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; REFRIGERATION; THERMOELECTRICITY;

COOLING MICROPROCESSORS; FIGURE OF MERIT (ZT) VALUES; JUNCTION TEMPERATURE; SOLID-STATE REFRIGERATION; THIN-FILM THERMOELECTRICS (TECS);

THIN FILMS;

EID: 33644804803     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.870392     Document Type: Article

References (11)

1. S. V. Garimella, Y. K. Joshi, A. Bar-Cohen, R. Mahajan, K. C. Toh, V. P. Carey, M. Baelmans, J. Lohan, B. Sammakia, and F. Andros, "Thermal challenges in next generation electronic systems - Summary of panel presentations and discussions," IEEE Trans. Comp. Packag. Technol., vol. 25, no. 4, pp. 569-575, Dec. 2002.
2. D. M. Rowe, Ed., CRC Handbook on Thermoelectrics. Orlando, FL: CRC, 1995.
3. F. Volklein, V. Baier, U. Dillner, and E. Kessler, "Transport properties of flash-evaporated (Bil-xSbx)2Te3 films I: Optimization of film properties," Thin Solid Films, vol. 187, pp. 253-262, 1990.
4. M. Stolzer, V. Bechstein, and J. Meusel, "Deposition of (Bi,Sb)/sub 2/Te/Sub 3/films by magnetron co-sputtering from two targets - first results," in Proc. Int. Conf. Thermoelectrics, vol. 15, 1996, p. 422.
5. H. Zhou, D. M. Rowe, and S. G. K. Williams, "Peltier effect in a co-evaporated Sb2Te3(P)-Bi2Te3(N) thin film thermocouple," Thin Solid Films, vol. 408, pp. 270-274, 2002.
6. M. Nedelcu, M. Sima, T. Visan, T. Pascu, I. Franga, and F. Craciuniou, "Bi/sub 2-x/Sb/sub x/Te/sub 3/thick thermoelectric films obtained by electrodeposition from hydrochloric acid solutions," in Proc. Int. Conf. Thermoelect., vol. 20, 2001, p. 322.
7. J. P. Fleurial, G. J. Snyder, J. A. Herman, P. H. Giauque, W. M. Philips, M. A. Ryan, P. Shakkotai, E. A. Kolawa, and M. A. Nicolet, "Thick-film thermoelectric microdevices," in Proc. Int. Conf. Thermoelect., vol. 18, 1999, p. 294.
8. F. Volklein, "Review of the thermoelectric efficiency of bulk and thin-film materials," Sens. Mater., vol. 8, pp. 389-00, 1996.
9. R. Venkatasubramanian, E. Silvola, T. Colpitts, and B. O'Quinn, "Thin-film thermoelectric devices with high room-temperature figures of merit," Nature, vol. 413, p. 597, 2001.
10. L. D. Hicks and M. S. Dresselhaus, "Effect of quantum-well structures on the thermoelectric figure of merit," Phys. Rev. B: Condensed Matter Mater. Phys., vol. 47, no. 19, pp. 12727-12731, May 1993.
11. V. Semenyuk, "Thermoelectric micro modules for spot cooling of high density heat sources," in Proc. Int. Conf. Thermoelect., vol. 20, 2001, p. 391.