-
3
-
-
0036868941
-
Highpower 4H-SiC JBS rectifiers
-
Nov.
-
R. Singh, D. C. Capell, A. R. Hefner, J. Lai, and J. W. Palmour, "Highpower 4H-SiC JBS rectifiers," IEEE Trans. Electron Devices, vol. 49, no. 11, pp. 2054-2063, Nov. 2002.
-
(2002)
IEEE Trans. Electron Devices
, vol.49
, Issue.11
, pp. 2054-2063
-
-
Singh, R.1
Capell, D.C.2
Hefner, A.R.3
Lai, J.4
Palmour, J.W.5
-
4
-
-
58149473454
-
Schottky versus bipolar 3.3 kV SiC diodes
-
AṔerez-Toḿas, P.Brosselard, J. Hassan,XJord̀a, P. Godignon, M. Placidi, A. Constant, J. Milĺan, and J. P. Bergman, "Schottky versus bipolar 3.3 kV SiC diodes," Semicond. Sci. Technol., vol. 23, pp. 125004-1-125004-7, 2008.
-
(2008)
Semicond. Sci. Technol.
, vol.23
, pp. 1250041-1250047
-
-
Aṕerez-Toḿas P.Brosselard1
Hassanxjord̀a, J.2
Godignon, P.3
Placidi, M.4
Constant, A.5
Milĺan, J.6
Bergman, J.P.7
-
5
-
-
84893039590
-
-
CPWR-AN01 Rev. A [Online]. Available
-
Application Notes CPWR-TECH1, 2005, CPWR-AN01, Rev. A, 2002 [Online]. Available: www.cree.com/power
-
(2002)
Application Notes CPWR-TECH1 2005
-
-
-
6
-
-
84893128023
-
-
[Online]. Available
-
(2013). [Online]. Available: www.infineon.com/sic
-
(2013)
-
-
-
7
-
-
84893128661
-
-
[Online]. Available
-
(2013). [Online]. Available: http://www.genesicsemi.com/index.php/ sicproducts/schottky
-
(2013)
-
-
-
8
-
-
84893099666
-
-
FF600R12IS4 F Data Sheet [Online]. Available
-
FF600R12IS4 F Data Sheet (2007). [Online]. Available: www.infineon.com
-
(2007)
-
-
-
9
-
-
34547102755
-
Power conversion with SiC devices at extremely high ambient temperatures
-
DOI 10.1109/TPEL.2007.900561
-
T. Funaki, J. C. Balda, J. Junghans, A. S. Kashyap, H. A. Mantooth, F. Barlow,T.Kimoto, andT.Hikihara, "Power conversion with SiC devices at extremely high ambient temperatures," IEEE Trans. Power Electron., vol. 22, no. 4, pp. 1321-1329, Jul. 2007. (Pubitemid 47098833)
-
(2007)
IEEE Transactions on Power Electronics
, vol.22
, Issue.4
, pp. 1321-1329
-
-
Funaki, T.1
Balda, J.C.2
Junghans, J.3
Kashyap, A.S.4
Mantooth, H.A.5
Barlow, F.6
Kimoto, T.7
Hikihara, T.8
-
10
-
-
82155192320
-
High-temperature SiC power module electrical evaluation procedure
-
Nov.
-
P. Ning, F.Wang, and K. D. T. Ngo, "High-temperature SiC power module electrical evaluation procedure," IEEE Trans. Power Electron., vol. 26, no. 11, pp. 3079-3083, Nov. 2011.
-
(2011)
IEEE Trans. Power Electron.
, vol.26
, Issue.11
, pp. 3079-3083
-
-
Ning, P.1
Wang, F.2
Ngo, K.D.T.3
-
11
-
-
84866495917
-
A high-temperature SiC three-phase AC-DC converter design for 100 ?C ambient temperature
-
Jan.
-
R. Wang, D. Boroyevich, P. Ning, Z. Wang, F. Wang, P. Mattavelli, K. D. T. Ngo, and K. Rajashekara, "A high-temperature SiC three-phase AC-DC converter design for 100 ?C ambient temperature," IEEE Trans. Power Electron., vol. 28, no. 1, pp. 555-572, Jan. 2013.
-
(2013)
IEEE Trans. Power Electron.
, vol.28
, Issue.1
, pp. 555-572
-
-
Wang, R.1
Boroyevich, D.2
Ning, P.3
Wang, Z.4
Wang, F.5
Mattavelli, P.6
Ngo, K.D.T.7
Rajashekara, K.8
-
12
-
-
79959301039
-
SiC Schottky diodes for harsh environment space applications
-
Jul.
-
P. Godignon, X. Jord̀a, M. Vellveh́?, X. Perpiǹa, V. Banu, D. Ĺopez, J. Barbero, P. Brosselard, and S. Massetti, "SiC Schottky diodes for harsh environment space applications," IEEE Trans. Ind. Electron., vol. 58, no. 7, pp. 2582-2590, Jul. 2011.
-
(2011)
IEEE Trans. Ind. Electron.
, vol.58
, Issue.7
, pp. 2582-2590
-
-
Godignon, P.1
Jord̀a, X.2
Vellveh́, M.3
Perpiǹa, X.4
Banu, V.5
Ĺopez, D.6
Barbero, J.7
Brosselard, P.8
Massetti, S.9
-
13
-
-
84883086903
-
New SiC thin-wafer technology paving theway of Schottky diodeswith improved performance and reliability
-
V. Scarpa, U. Kirchner, R. Kern, and R. Gerlach, "New SiC thin-wafer technology paving theway of Schottky diodeswith improved performance and reliability," Power Electron. Eur., no. 3, pp. 30-32, 2012.
-
(2012)
Power Electron. Eur.
, Issue.3
, pp. 30-32
-
-
Scarpa, V.1
Kirchner, U.2
Kern, R.3
Gerlach, R.4
-
14
-
-
63149095671
-
Recent progress in SiC DMOSFETs and JBS diodes at Cree
-
R. J. Callanan,A.Agarwal, A. Burk,M.Das, B.Hull, F. Husna, A. Powell, J. Richmond, S-H. Ryu, and Q. Zhang, "Recent progress in SiC DMOSFETs and JBS diodes at Cree," in Proc. 34th Ind. Electron. Conf., 2008, pp. 2885-2890.
-
(2008)
Proc. 34th Ind. Electron. Conf.
, pp. 2885-2890
-
-
Callanan, R.J.1
Agarwal, A.2
Burk, A.3
Das, M.4
Hull, B.5
Husna, F.6
Powell, A.7
Richmond, J.8
Ryu, S.-H.9
Zhang, Q.10
-
15
-
-
34247518761
-
A 180 Amp/4.5 kV 4H-SiC PiN diode for high current power modules
-
B. A. Hull, M. K. Das, J. T. Richmond, J. J. Sumakeris, R. Leonard, J. W. Palmour, and S. Leslie, "A 180 Amp/4.5 kV 4H-SiC PiN diode for high current power modules," in Proc. Int. Symp. Power Semicond. Devices ICs, 2006, pp. 277-280.
-
(2006)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 277-280
-
-
Hull, B.A.1
Das, M.K.2
Richmond, J.T.3
Sumakeris, J.J.4
Leonard, R.5
Palmour, J.W.6
Leslie, S.7
-
16
-
-
84864772036
-
Breakdown characteristics of 12-20 kV-class 4H-SiC PiN diodes with improved junction termination structures
-
H. Niwa, G. Feng, J. Suda, and T. Kimoto, "Breakdown characteristics of 12-20 kV-class 4H-SiC PiN diodes with improved junction termination structures," in Proc. Int. Symp. Power Semicond. Devices ICs, 2012, pp. 381-384.
-
(2012)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 381-384
-
-
Niwa, H.1
Feng, G.2
Suda, J.3
Kimoto, T.4
-
18
-
-
33745730787
-
Today's and tomorrow's industrial utilization of silicon carbide power devices
-
Toulouse, France Paper 1199
-
D. Stephani, "Today's and tomorrow's industrial utilization of silicon carbide power devices," presented at the 10th Eur. Conf. Power Electron. Appl., Toulouse, France, 2003, Paper 1199.
-
(2003)
10th Eur. Conf. Power Electron. Appl.
-
-
Stephani, D.1
-
19
-
-
84893074674
-
-
[Online].Available
-
(2012). [Online].Available: http://www.infineon.com/cms/en/product/ discretesand-standard-products/coolsic-tm-sic-jfet/channel.html
-
(2012)
-
-
-
20
-
-
30344471061
-
Normally-off trench JFET technology in 4H silicon carbide
-
DOI 10.1016/j.mee.2005.10.035, PII S0167931705004971
-
R. K. Malhan, Y. Takeuchi, M. Kataoka, A.-P. Mihaila, S. J. Rashid, F. Udrea, and G. A. J. Amaratunga, "Normally-off trench JFET technology in 4H silicon carbide," Microelectron. Eng., vol. 83, pp. 107-111, 2006. (Pubitemid 43065194)
-
(2006)
Microelectronic Engineering
, vol.83
, Issue.1 SPEC. ISSUE.
, pp. 107-111
-
-
Malhan, R.K.1
Takeuchi, Y.2
Kataoka, M.3
Mihaila, A.-P.4
Rashid, S.J.5
Udrea, F.6
Amaratunga, G.A.J.7
-
21
-
-
4444300180
-
Recent advances in (0001) 4H-SiC MOS device technology
-
M. K. Das, "Recent advances in (0001) 4H-SiC MOS device technology," Mater. Sci. Forum, vol. 457-460, pp. 1275-1280, 2004.
-
(2004)
Mater. Sci. Forum
, vol.457-460
, pp. 1275-1280
-
-
Das, M.K.1
-
22
-
-
77954144905
-
Improved inversion channel mobility in 4H-SiC MOSFETs on Si face utilizing phosphorus-doped gate oxide
-
Jul.
-
D. Okamoto, H. Yano, K. Hirata, T. Hatayama, and T. Fuyuki, "Improved inversion channel mobility in 4H-SiC MOSFETs on Si face utilizing phosphorus-doped gate oxide," IEEE Electron Devices Lett., vol. 31, no. 7, pp. 710-712, Jul. 2010.
-
(2010)
IEEE Electron Devices Lett.
, vol.31
, Issue.7
, pp. 710-712
-
-
Okamoto, D.1
Yano, H.2
Hirata, K.3
Hatayama, T.4
Fuyuki, T.5
-
23
-
-
8644277173
-
Benefits of high-k dielectrics in 4H-SiC trench MOSFETs
-
N. G. Wright, N. Poolami, K. V. Vassilevski, A. B. Horsfall, and C. M. Johnson, "Benefits of high-k dielectrics in 4H-SiC trench MOSFETs," Mater. Sci. Forum, vol. 457-460, pp. 1433-1436, 2004.
-
(2004)
Mater. Sci. Forum
, vol.457-460
, pp. 1433-1436
-
-
Wright, N.G.1
Poolami, N.2
Vassilevski, K.V.3
Horsfall, A.B.4
Johnson, C.M.5
-
24
-
-
36048959854
-
Process optimisation for 4H-SiC MOSFET applications
-
C. Blanc, D. Tournier, P. Godignon, D. J. Bring, V. Souliere, and J. Camassel, "Process optimisation for 4H-SiC MOSFET applications," Mater. Sci. Forum, vol. 527-529, pp. 1051-1054, 2006.
-
(2006)
Mater. Sci. Forum
, vol.527-529
, pp. 1051-1054
-
-
Blanc, C.1
Tournier, D.2
Godignon, P.3
Bring, D.J.4
Souliere, V.5
Camassel, J.6
-
25
-
-
77954732237
-
Performance, reliability, and robustness of 4H-SiC power DMOSFETs
-
S. Ryu, B. Hull, S. Dhar, L. Cheng, Q. Zhang, J. Richmond, M. Das, A. Agarwal, J. Palmour, A Lelis, B. Geil, and C. Scozzie, "Performance, reliability, and robustness of 4H-SiC power DMOSFETs," Mater. Sci. Forum, vol. 645-648, pp. 969-974, 2010.
-
(2010)
Mater. Sci. Forum
, vol.645-648
, pp. 969-974
-
-
Ryu, S.1
Hull, B.2
Dhar, S.3
Cheng, L.4
Zhang, Q.5
Richmond, J.6
Das, M.7
Agarwal, A.8
Palmour, J.9
Lelis, A.10
Geil, B.11
Scozzie, C.12
-
26
-
-
84893102673
-
-
[Online]. Available
-
(2012). [Online]. Available: http://www.cree.com/products/pdf/CMF20120D. pdf
-
(2012)
-
-
-
27
-
-
84893125069
-
-
[Online]. Available
-
(2012). [Online]. Available: http://www.rohm.com
-
(2012)
-
-
-
28
-
-
84893027237
-
-
[Online].Available
-
(2012). [Online].Available: http://www.rohm.com/products/sic/trench.html
-
(2012)
-
-
-
30
-
-
84893078992
-
-
[Online]. Available
-
(2013). [Online]. Available: http://www.pwrx.com/summary/SiCModules.aspx
-
(2013)
-
-
-
31
-
-
80053180055
-
Evaluation of a 1200-V, 800-A all-SiC dual module
-
Sep.
-
R. A.Wood and T. E. Salem, "Evaluation of a 1200-V, 800-A all-SiC dual module," IEEE Trans. Power Electron., vol. 26, no. 9, pp. 2504-2511, Sep. 2011.
-
(2011)
IEEE Trans. Power Electron.
, vol.26
, Issue.9
, pp. 2504-2511
-
-
Wood, R.A.1
Salem, T.E.2
-
32
-
-
34247548849
-
10 kV, 5 A 4H-SiC power DMOSFET
-
S.-H. Ryu, S. Krishnaswami, B. Hull, J. Richmond, A. Agarwal, and A. Hefner, "10 kV, 5 A 4H-SiC power DMOSFET," in Proc. Int. Symp. Power Semicond. Devices ICs, 2006, pp. 265-268.
-
(2006)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 265-268
-
-
Ryu, S.-H.1
Krishnaswami, S.2
Hull, B.3
Richmond, J.4
Agarwal, A.5
Hefner, A.6
-
33
-
-
84864760062
-
Ultra high voltage (12 kV), high performance 4H-SiC IGBTs
-
S.-H. Ryu, C. Capell, C. Jonas, L. Cheng, M. O'Loughlin, A. Burk, A. Agarwal, J. Palmour, and A. Hefner, "Ultra high voltage (12 kV), high performance 4H-SiC IGBTs," in Proc. Int. Symp. Power Semicond. Devices ICs, 2012, pp. 257-260.
-
(2012)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 257-260
-
-
Ryu, S.-H.1
Capell, C.2
Jonas, C.3
Cheng, L.4
O'Loughlin, M.5
Burk, A.6
Agarwal, A.7
Palmour, J.8
Hefner, A.9
-
34
-
-
77955454486
-
Breakthrough in power electronics from SiC
-
Golden, CO, USA, NREL/SR-
-
D. A. Marckx, "Breakthrough in power electronics from SiC," Nat. Renewable Energy Lab., Golden, CO, USA, NREL/SR-500-38515, 2006.
-
(2006)
Nat. Renewable Energy Lab.
, pp. 500-38515
-
-
Marckx, D.A.1
-
35
-
-
34247521076
-
4 kV, 10 A bipolar junction transistors in 4H-SiC
-
S. Krishnaswami, A. Agarwal, J. Richmond, T. P. Chow, B. Geil, K. Jones, and C. Scozzie, "4 kV, 10 A bipolar junction transistors in 4H-SiC," in Proc. Int. Symp. Power Semicond. Devices ICs, 2006, pp. 289-292.
-
(2006)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 289-292
-
-
Krishnaswami, S.1
Agarwal, A.2
Richmond, J.3
Chow, T.P.4
Geil, B.5
Jones, K.6
Scozzie, C.7
-
36
-
-
79955124780
-
Current gain degradation in 4H-SiC power BJTs
-
B. Buono, R. Ghandi, M. Domeij, B. G. Malm, C.-M. Zetterling, and M. Ostling, "Current gain degradation in 4H-SiC power BJTs," Mater. Sci. Forum, vol. 679-680, pp. 702-705, 2011.
-
(2011)
Mater. Sci. Forum
, vol.679-680
, pp. 702-705
-
-
Buono, B.1
Ghandi, R.2
Domeij, M.3
Malm, B.G.4
Zetterling, C.-M.5
Ostling, M.6
-
37
-
-
34247526513
-
4.5 kV 120 A SICGT and Its PWM three phase inverter operation of 100 kVA Class
-
Y. Sugawara, Y. Miyanagi, K. Asano, A. Agarwal, S. Ryu, J. Palmour, Y. Shoji, S. Okada, S. Ogata, and T. Izumi, "4.5 kV 120 A SICGT and Its PWM three phase inverter operation of 100 kVA Class," in Proc. Int. Symp. Power Semicond. Devices ICs, 2006, pp. 117-120.
-
(2006)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 117-120
-
-
Sugawara, Y.1
Miyanagi, Y.2
Asano, K.3
Agarwal, A.4
Ryu, S.5
Palmour, J.6
Shoji, Y.7
Okada, S.8
Ogata, S.9
Izumi, T.10
-
38
-
-
84864772318
-
Reliability investigation of SiC bipolar device module in long time inverter operation
-
A. Tanaka, S.Ogata, T. Izumi, K. Nakayama, T.Hayashi,Y.Miyanagi, and K. Asano, "Reliability investigation of SiC bipolar device module in long time inverter operation," in Proc. Int. Symp. Power Semicond. Devices ICs, 2012, pp. 233-236.
-
(2012)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 233-236
-
-
Tanaka, A.1
Ogata, S.2
Izumi, T.3
Nakayama, K.4
Hayashi, T.5
Miyanagi, Y.6
Asano, K.7
-
39
-
-
84864754611
-
Au-free CMOS-compatible AlGaN/GaN HMET processing on 200 mm Si substrates
-
B. De Jaeger,M. V. Hove, D.Wellekens, X. Kang, H. Liang, G. Mannaert, K. Geens, and S. Decoutere, "Au-free CMOS-compatible AlGaN/GaN HMET processing on 200 mm Si substrates," in Proc. Int. Symp. Power Semicond. Devices ICs, 2012, pp. 49-52.
-
(2012)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 49-52
-
-
De Jaeger, B.1
Hove, M.V.2
Wellekens, D.3
Kang, X.4
Liang, H.5
Mannaert, G.6
Geens, K.7
Decoutere, S.8
-
40
-
-
0035279875
-
Comparison of GaN P-I-N and Schottky rectifier performance
-
DOI 10.1109/16.906427, PII S0018938301014447
-
A. P. Zhang, G. T. Dang, F. Ren, H. Cho, K.-P. Lee, S. J. Pearton, J.-I. Chyi, T.-Y. Nee, and C.-C. Chuo, "Comparison of GaN P-I-N and Schottky rectifier performance," IEEE Trans. Electron. Devices, vol. 48, no. 3, pp. 407-411, Mar. 2001. (Pubitemid 32271153)
-
(2001)
IEEE Transactions on Electron Devices
, vol.48
, Issue.3
, pp. 407-411
-
-
Zhang, A.P.1
Dang, G.T.2
Ren, F.3
Cho, H.4
Lee, K.-P.5
Pearton, S.J.6
Chyi, J.-I.7
Nee, T.-E.8
Lee, C.-M.9
Chuo, C.-C.10
-
41
-
-
20244389668
-
1-xN power rectifiers with 9.7 kV reverse breakdown voltage
-
DOI 10.1063/1.1346622
-
A. P. Zhang, J. W. Jonson, F. Ren, J. Han, A. Y. Polyakov, N. B. Smirnov, A. V. Govorkov, J. M. Redwing, K. P. Lee, and S. J. Pearton, "Lateral Alx Ga1?xN power rectifiers with 9.7 kV reverse breakdown voltage," Appl. Phys. Lett., vol. 78, pp. 823-825, 2001. (Pubitemid 33630362)
-
(2001)
Applied Physics Letters
, vol.78
, Issue.6
, pp. 823-825
-
-
Zhang, A.P.1
Johnson, J.W.2
Ren, F.3
Han, J.4
Polyakov, A.Y.5
Smirnov, N.B.6
Govorkov, A.V.7
Redwing, J.M.8
Lee, K.P.9
Pearton, S.J.10
-
42
-
-
84893055732
-
-
[Online]. Available
-
(2010) [Online]. Available: http://www.powdec.co.jp/Diode.pdf
-
(2010)
-
-
-
43
-
-
62349110652
-
Effects of cap layer on ohmic Ti/Al contacts to Si+ implanted GaN
-
M. Placidi, A. Ṕerez-Toḿas, A. Constant, G. Rius, N. Mestres, J. Milĺan, and P. Godignon, "Effects of cap layer on ohmic Ti/Al contacts to Si+ implanted GaN," Appl. Surface Sci., vol. 255, pp. 6057-6060, 2009.
-
(2009)
Appl. Surface Sci.
, vol.255
, pp. 6057-6060
-
-
Placidi, M.1
Ṕerez-Toḿas, A.2
Constant, A.3
Rius, G.4
Mestres, N.5
Milĺan, J.6
Godignon, P.7
-
44
-
-
84864744753
-
A HfO2 based 800 V/300 ?C Au-freeAlGaN/GaN-on-SiHEMTtechnology
-
A. Fontser̀e, A. Ṕerez-Toḿas, V. Banu, P. Godignon, J. Milĺan, H. De Vleeschouwer, J. M. Parsey, and P.Moens, "A HfO2 based 800 V/300 ?C Au-freeAlGaN/GaN-on-SiHEMTtechnology," in Proc. Int. Symp. Power Semicond. Devices ICs, 2012, pp. 37-40.
-
(2012)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 37-40
-
-
Fontser̀e, A.1
Ṕerez-Toḿas, A.2
Banu, V.3
Godignon, P.4
Milĺan, J.5
De Vleeschouwer, H.6
Parsey, J.M.7
Moens, P.8
-
45
-
-
0041388596
-
Microwave performance of a 0.25 ?m gate AlGaN/GaN heterostructure field effect transistor
-
M. A. Khan, J. N. Kuznia, D. T. Olson, W. J. Schaff, J. W. Burm, and M. S. Shur, "Microwave performance of a 0.25 ?m gate AlGaN/GaN heterostructure field effect transistor," Appl. Phys. Lett., vol. 65, pp. 1121-1123, 1994.
-
(1994)
Appl. Phys. Lett.
, vol.65
, pp. 1121-1123
-
-
Khan, M.A.1
Kuznia, J.N.2
Olson, D.T.3
Schaff, W.J.4
Burm, J.W.5
Shur, M.S.6
-
46
-
-
33845983822
-
40-W/mm double field-plated GaN HEMTs
-
Y.-F. Wu, M. Moore, A. Saxler, T. Wisleder, and P. Parikh, "40-W/mm double field-plated GaN HEMTs," in Proc. IEEE Device Res. Conf., 2006, pp. 151-152.
-
(2006)
Proc. IEEE Device Res. Conf.
, pp. 151-152
-
-
Wu, Y.-F.1
Moore, M.2
Saxler, A.3
Wisleder, T.4
Parikh, P.5
-
47
-
-
51549085821
-
High power AlGaN/GaN HFET with a high breakdown voltage of over 1.8 kV on 4-inch Si substrates and the suppression of current collapse
-
N. Ikeda, S. Kaya, J. Li, Y. Sato, S. Kato, and S. Yoshida, "High power AlGaN/GaN HFET with a high breakdown voltage of over 1.8 kV on 4-inch Si substrates and the suppression of current collapse," in Proc. Int. Symp. Power Semicond. Devices ICs, 2008, pp. 287-290.
-
(2008)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 287-290
-
-
Ikeda, N.1
Kaya, S.2
Li, J.3
Sato, Y.4
Kato, S.5
Yoshida, S.6
-
48
-
-
36749083413
-
AlGaN/GaN HEMTs passivated by Cat-CVD SiN Film
-
DOI 10.1016/j.tsf.2007.06.223, PII S0040609007009261, Proceedings of the Fourth International Conference on Hot-Wire Cat-CVD Process
-
T. Oku, Y. Kamo, and M. Totsuka, "AlGaN/GaN HEMTs passivated by Cat-CVD SiN Film," Thin Solid Films, vol. 516, pp. 545-547, 2008. (Pubitemid 350212981)
-
(2008)
Thin Solid Films
, vol.516
, Issue.5
, pp. 545-547
-
-
Oku, T.1
Kamo, Y.2
Totsuka, M.3
-
49
-
-
34247516950
-
Fabrication of AlGaN/GaN HFET with a high breakdown voltage of over 1050 v
-
S. Yoshida, J. Li, H. Takehara, H. Kambayashi, and N. Ikeda, "Fabrication of AlGaN/GaN HFET with a high breakdown voltage of over 1050 V," in Proc. Int. Symp. Power Semicond. Devices ICs, 2006, pp. 317-320.
-
(2006)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 317-320
-
-
Yoshida, S.1
Li, J.2
Takehara, H.3
Kambayashi, H.4
Ikeda, N.5
-
50
-
-
78049248925
-
AlGaN/GaN/GaN:C back-barrier HFETs with breakdown voltage of over 1 kV and low RON ?A
-
Nov.
-
E. Bahat-Treidel, F. Brunner, O. Hilt, E. Cho, J. Ẅurfl, and G. Tr̈ankle, "AlGaN/GaN/GaN:C back-barrier HFETs with breakdown voltage of over 1 kV and low RON ?A," IEEE Trans. Electron. Devices, vol. 57, no. 11, pp. 3050-3058, Nov. 2010.
-
(2010)
IEEE Trans. Electron. Devices
, vol.57
, Issue.11
, pp. 3050-3058
-
-
Bahat-Treidel, E.1
Brunner, F.2
Hilt, O.3
Cho, E.4
Ẅurfl, J.5
Tr̈ankle, G.6
-
51
-
-
78650911175
-
Record breakdown voltage (2200 V) of GaN DHFETs on Si with 2-?m buffer thickness by local substrate removal
-
Jan.
-
P. Srivastava, J. Das, D. Visalli, M. Van Hove, P. E. Malinowski, D. Marcon, S. Lenci, K. Geens, K. Cheng, M. Leys, S. Decoutere, R. P. Mertens, and G. Borghs, "Record breakdown voltage (2200 V) of GaN DHFETs on Si with 2-?m buffer thickness by local substrate removal," IEEE Electron Dev. Lett., vol. 32, no. 1, pp. 30-32, Jan. 2011.
-
(2011)
IEEE Electron Dev. Lett.
, vol.32
, Issue.1
, pp. 30-32
-
-
Srivastava, P.1
Das, J.2
Visalli, D.3
Van Hove, M.4
Malinowski, P.E.5
Marcon, D.6
Lenci, S.7
Geens, K.8
Cheng, K.9
Leys, M.10
Decoutere, S.11
Mertens, R.P.12
Borghs, G.13
-
52
-
-
34247500476
-
GaN switching devices for high-frequency, kW power conversion
-
K. S. Boutros, S. Chandrasekaran, W. B. Luo, and V. Mehrotra, "GaN switching devices for high-frequency, kW power conversion," in Proc. Int. Symp. Power Semiconductor Devices and ICs, 2006, pp. 321-323.
-
(2006)
Proc. Int. Symp. Power Semiconductor Devices and ICs
, pp. 321-323
-
-
Boutros, K.S.1
Chandrasekaran, S.2
Luo, W.B.3
Mehrotra, V.4
-
53
-
-
50249183991
-
8300 v blocking voltage AlGaN/GaN power HFET with thick poly-AIN passivation
-
Y. Uemoto, D. Shibata, M. Yanagihara, H. Ishida, H. Matsuo, S. Nagai, N. Batta, M. Li, T. Ueda, T. Tanaka, and D. Ueda, "8300 V blocking voltage AlGaN/GaN power HFET with thick poly-AIN passivation," in IEDM Tech. Dig., 2007, pp. 861-864.
-
(2007)
IEDM Tech. Dig.
, pp. 861-864
-
-
Uemoto, Y.1
Shibata, D.2
Yanagihara, M.3
Ishida, H.4
Matsuo, H.5
Nagai, S.6
Batta, N.7
Li, M.8
Ueda, T.9
Tanaka, T.10
Ueda, D.11
-
54
-
-
31744436913
-
Recessed-gate structure approach toward normally off high-voltage AlGaN/GaN HEMT for power electronics applications
-
DOI 10.1109/TED.2005.862708
-
W. Saito, Y. Takada, M. Kuraguchi, K. Tsuda, and I. Omura, "Recessedgate structure approach toward normally-off high-voltage AlGaN/GaN HEMT for power electronics applications," IEEE Trans. Electron. Devices, vol. 53, no. 2, pp. 356-362, Feb. 2006. (Pubitemid 43174052)
-
(2006)
IEEE Transactions on Electron Devices
, vol.53
, Issue.2
, pp. 356-362
-
-
Saito, W.1
Takada, Y.2
Kuraguchi, M.3
Tsuda, K.4
Omura, I.5
-
55
-
-
33947182926
-
Control of threshold voltage of AlGaN/GaN HEMTs by fluoride-based plasma treatment: From depletion mode to enhancement mode
-
Sep.
-
Y. Cai, Y. Zhou, K. M. Lau, and K. J. Chen, "Control of threshold voltage of AlGaN/GaN HEMTs by fluoride-based plasma treatment: From depletion mode to enhancement mode," IEEE Trans. Electron. Devices, vol. 53, no. 9, pp. 2207-2215, Sep. 2006.
-
(2006)
IEEE Trans. Electron. Devices
, vol.53
, Issue.9
, pp. 2207-2215
-
-
Cai, Y.1
Zhou, Y.2
Lau, K.M.3
Chen, K.J.4
-
56
-
-
33744718459
-
High-performance e-mode AlGaN/GaN HEMTs
-
DOI 10.1109/LED.2006.874761
-
T. Palacios, C.-S. Suh, A. Chakraborty, S. Keller, S. P. DenBaars, and U. K. Mishra, "High-performance E-Mode AlGaN/GaN HEMTs," IEEE Electron. Devices Lett., vol. 27, no. 6, pp. 428-430, Jun. 2006. (Pubitemid 43821728)
-
(2006)
IEEE Electron Device Letters
, vol.27
, Issue.6
, pp. 428-430
-
-
Palacios, T.1
Suh, C.-S.2
Chakraborty, A.3
Keller, S.4
DenBaars, S.P.5
Mishra, U.K.6
-
57
-
-
0033873293
-
Enhancement mode AlGaN/GaN HFET with selectively grown pn junction gate
-
DOI 10.1049/el:20000557
-
X. Hu, G. Simin, J. Yang, M. A. Khan, R. Gaska, and M. S. Shur, "Enhancement-mode AlGaN/GaN HFET with selectively grown pn junction gate," Electron. Lett., vol. 36, pp. 753-754, 2000. (Pubitemid 30593948)
-
(2000)
Electronics Letters
, vol.36
, Issue.8
, pp. 753-754
-
-
Hu, X.1
Simin, G.2
Yang, J.3
Asif Khan, M.4
Gaska, R.5
Shur, M.S.6
-
58
-
-
84864771877
-
Impact of buffer composition on the dynamic on-state resistance of high-voltage AlGaN/GaN HFETs
-
O. Hilt, E. Bahat-Treidel, E. Cho, S. Singwald, and J. Ẅurfl, "Impact of buffer composition on the dynamic on-state resistance of high-voltage AlGaN/GaN HFETs," in Proc. Int. Symp. Power Semicond. Devices ICs, 2012, pp. 345-348.
-
(2012)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 345-348
-
-
Hilt, O.1
Bahat-Treidel, E.2
Cho, E.3
Singwald, S.4
Ẅurfl, J.5
-
59
-
-
84893112880
-
-
[Online]. Available
-
(2013). [Online]. Available: http://epc-co.com
-
(2013)
-
-
-
60
-
-
84893089360
-
-
[Online]. Available
-
(2013). [Online]. Available: http://www.microgan.com/
-
(2013)
-
-
-
61
-
-
84864780622
-
GaN-based bidirectional super HFETs using polarization junction concept on insulator substrate
-
A. Nakajima, V. Unni, K. G. Menon, M. H. Dhyani, E. M. Sankara Narayanan, Y. Sumida, and H. Kawai, "GaN-based bidirectional super HFETs using polarization junction concept on insulator substrate," in Proc. Int. Symp. Power Semicond. Devices ICs, 2012, pp. 265-268.
-
(2012)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 265-268
-
-
Nakajima, A.1
Unni, V.2
Menon, K.G.3
Dhyani, M.H.4
Sankara Narayanan, E.M.5
Sumida, Y.6
Kawai, H.7
-
62
-
-
77954579480
-
GaN smart power IC technology
-
K-YWong,W. Chen, X. Liu, C. Zhou, and K. J. Chen, "GaN smart power IC technology," Phys. Status Solidi B, vol. 247, no. 7, pp. 1732-1734, 2010.
-
(2010)
Phys. Status Solidi B
, vol.247
, Issue.7
, pp. 1732-1734
-
-
Ywong, K.1
Chen, W.2
Liu, X.3
Zhou, C.4
Chen, K.J.5
-
63
-
-
51549112941
-
Lateral implanted RESURF GaN MOSFETs with BV up to 2.5 kV
-
W. Huang, T. P. Chow, Y. Niiyama, T. Nomura, and S. Yoshida, "Lateral implanted RESURF GaN MOSFETs with BV up to 2.5 kV," in Proc. Int. Symp. Power Semicond. Devices ICs, 2008, pp. 291-294.
-
(2008)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 291-294
-
-
Huang, W.1
Chow, T.P.2
Niiyama, Y.3
Nomura, T.4
Yoshida, S.5
-
64
-
-
77950297229
-
Over 100 A operation normally-off AlGaN/GaN hybrid MOS-HFET on Si substrate with high-breakdown voltage
-
H. Kambayashi, Y. Satoh, S. Ootomo, T. Kokawa, T. Nomura, S. Kato, and T. P. Chow, "Over 100 A operation normally-off AlGaN/GaN hybrid MOS-HFET on Si substrate with high-breakdown voltage," Solid-State Electron., vol. 54, pp. 660-664, 2010.
-
(2010)
Solid-State Electron
, vol.54
, pp. 660-664
-
-
Kambayashi, H.1
Satoh, Y.2
Ootomo, S.3
Kokawa, T.4
Nomura, T.5
Kato, S.6
Chow, T.P.7
-
65
-
-
51449124688
-
Enhanced-mode GaN hybrid MOS-HEMTs with Ron,sp of 20 m?cm2
-
W. Huang, T. P. Chow, Y. Niyama, and S. Yoshida, "Enhanced-mode GaN hybrid MOS-HEMTs with Ron,sp of 20 m?cm2," in Proc. Int. Symp. Power Semicond. Devices ICs, 2008, pp. 295-298.
-
(2008)
Proc. Int. Symp. Power Semicond. Devices ICs
, pp. 295-298
-
-
Huang, W.1
Chow, T.P.2
Niyama, Y.3
Yoshida, S.4
-
66
-
-
47249146111
-
AlGaN/GaN recessed MIS-gate HFET with highthreshold-voltage normally-off operation for power electronics applications
-
Jul.
-
T. Oka and T. Nozawa, "AlGaN/GaN recessed MIS-gate HFET with highthreshold-voltage normally-off operation for power electronics applications," IEEE Electron Device Lett., vol. 29, no. 7, pp. 668-670, Jul. 2008.
-
(2008)
IEEE Electron Device Lett.
, vol.29
, Issue.7
, pp. 668-670
-
-
Oka, T.1
Nozawa, T.2
|