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Volumn 28, Issue 1, 2013, Pages 555-572

A high-temperature SiC three-phase AC-DC converter design for >100 ̂c ambient temperature

Author keywords

Harsh environment; high temperature (HT) converter; silicon carbide JFET; silicon on insulator (SOI) technology

Indexed keywords

AC-DC CONVERTERS; CONTROL ELECTRONICS; DETAILED DESIGN; GATE DRIVES; HARSH ENVIRONMENT; HIGH TEMPERATURE; HYBRID ELECTRICAL VEHICLE; PASSIVE COMPONENTS; PETROLEUM EXPLORATION; PLANAR STRUCTURE; POWER MODULE; SILICON ON INSULATOR; SILICONON-INSULATOR TECHNOLOGY (SOI); THREE-PHASE PWM RECTIFIERS;

EID: 84866495917     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2012.2199131     Document Type: Article
Times cited : (125)

References (35)
  • 1
    • 0035304065 scopus 로고    scopus 로고
    • Review on materials, microsensors, systems, and devices for high-temperature and harsh-environment applications
    • DOI 10.1109/41.915402, PII S0278004601026223
    • M. R. Werner and W. R. Fahrner, "Review on materials, microsensors, systems and devices for high-temperature and harsh-environment applications," IEEE Trans. Ind. Electron., vol. 48, no. 2, pp. 249-257, Apr. 2001 (Pubitemid 32416251)
    • (2001) IEEE Transactions on Industrial Electronics , vol.48 , Issue.2 , pp. 249-257
    • Werner, M.R.1    Fahrner, W.R.2
  • 2
    • 11244292142 scopus 로고    scopus 로고
    • Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments
    • 1132, 2004 IEEE Aerospace Conference Proceedings
    • J. Hornberger, A. B. Lostetter, K. J. Olejniczak, T. Mcnutt, S. M. Lal, and A. Mantooth, "Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments," in Proc. IEEE Aerosp. Conf., 2004, vol. 4, pp. 2538-2555 (Pubitemid 40057252)
    • (2004) IEEE Aerospace Conference Proceedings , vol.4 , pp. 2538-2555
    • Hornberger, J.1    Lostetter, A.B.2    Olejniczak, K.J.3    McNutt, T.4    Lal, S.M.5    Mantooth, A.6
  • 10
    • 76649133450 scopus 로고    scopus 로고
    • SiC wirebond multichip phase-leg module packaging design and testing for harsh environment
    • Jan.
    • N. Puqi, L. Rixin, D. Huff, F.Wang, K. D. T. Ngo, V. D. Immanuel, and K. J. Karimi, "SiC wirebond multichip phase-leg module packaging design and testing for harsh environment," IEEE Trans. Power Electron., vol. 25, no. 1, pp. 16-23, Jan. 2010
    • (2010) IEEE Trans. Power Electron. , vol.25 , Issue.1 , pp. 16-23
    • Puqi, N.1    Rixin, L.2    Huff, D.3    Wang, F.4    Ngo, K.D.T.5    Immanuel, V.D.6    Karimi, K.J.7
  • 11
    • 0026077011 scopus 로고
    • An active power factor correction technique for three-phase diode rectifiers
    • Jan.
    • A. R. Prasad, P. D. Ziogas, and S. Manias, "An active power factor correction technique for three-phase diode rectifiers," IEEE Trans. Power Electron., vol. 6, no. 1, pp. 83-92, Jan. 1991
    • (1991) IEEE Trans. Power Electron. , vol.6 , Issue.1 , pp. 83-92
    • Prasad, A.R.1    Ziogas, P.D.2    Manias, S.3
  • 14
    • 81155154419 scopus 로고    scopus 로고
    • A labscale alternative interconnection solution of semiconductor dice compatible with power modules 3-D integration
    • Jul.
    • L. Menager, M. Soueidan, B. Allard, V. Bley, and B. Schlegel, "A labscale alternative interconnection solution of semiconductor dice compatible with power modules 3-D integration," IEEE Trans. Power Electron., vol. 25, no. 7, pp. 1667-1670, Jul. 2010
    • (2010) IEEE Trans. Power Electron. , vol.25 , Issue.7 , pp. 1667-1670
    • Menager, L.1    Soueidan, M.2    Allard, B.3    Bley, V.4    Schlegel, B.5
  • 16
    • 67349103413 scopus 로고    scopus 로고
    • Die-attachment solutions for SiC power devices
    • Jun.
    • R. Kisiel and Z. Szczepanski, "Die-attachment solutions for SiC power devices," Microelectron. Rel., vol. 49, pp. 627-629, Jun. 2009
    • (2009) Microelectron. Rel. , vol.49 , pp. 627-629
    • Kisiel, R.1    Szczepanski, Z.2
  • 17
    • 34548175460 scopus 로고    scopus 로고
    • High-temperature operation of SiC power devices by low-temperature sintered silver die-attachment
    • DOI 10.1109/TADVP.2007.898628, Special Section on Wafer-Level Packaging
    • J. G. Bai, J. Yin, Z. Zhang, L. Guo-Quan, and J. D. van Wyk, "Hightemperature operation of SiC power devices by low-temperature sintered silver die-attachment," IEEE Trans. Adv. Packag., vol. 30, no. 3, pp. 506-510, Aug. 2007 (Pubitemid 47308009)
    • (2007) IEEE Transactions on Advanced Packaging , vol.30 , Issue.3 , pp. 506-510
    • Bai, J.G.1    Yin, J.2    Zhang, Z.3    Lu, G.-Q.4    Van Wyk, J.D.5
  • 18
    • 77952148799 scopus 로고    scopus 로고
    • Comprehensive compact models for the circuit simulation of multichip powermodules
    • May
    • A. Castellazzi, "Comprehensive compact models for the circuit simulation of multichip powermodules," IEEE Trans. Power Electron., vol. 25, no. 5, pp. 1251-1264, May 2010
    • (2010) IEEE Trans. Power Electron. , vol.25 , Issue.5 , pp. 1251-1264
    • Castellazzi, A.1
  • 20
    • 33744987221 scopus 로고    scopus 로고
    • Effect and utilization of common source inductance in synchronous rectification
    • DOI 10.1109/APEC.2005.1453213, 1453213, Twentieth Annual IEEEApplied Power ElectronicsConference and Exposition, APEC 2005
    • B.Yang and J. Zhang, "Effect and utilization of common source inductance in synchronous rectification," in Proc. 20th Annu. IEEE Appl. Power Electron. Conf. Expo., 2005, vol. 3, pp. 1407-1411 (Pubitemid 43860968)
    • (2005) Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC , vol.3 , pp. 1407-1411
    • Yang, B.1    Zhang, J.2
  • 24
    • 50249162106 scopus 로고    scopus 로고
    • Design and fabrication of a high temperature (250 ̂A?C baseplate), high power density silicon carbide (SiC) multichip power module (MCPM) inverter
    • E. Cilio, J. Hornberger, B. McPherson, R. Schupbach, and A. Lostetter, "Design and fabrication of a high temperature (250 ̂A?C baseplate), high power density silicon carbide (SiC) multichip power module (MCPM) inverter," in Proc. 32nd Annu. Conf. IEEE Ind. Electron., 2006, pp. 1822-1827
    • (2006) Proc. 32nd Annu. Conf. IEEE Ind. Electron. , pp. 1822-1827
    • Cilio, E.1    Hornberger, J.2    McPherson, B.3    Schupbach, R.4    Lostetter, A.5
  • 25
    • 63149144638 scopus 로고    scopus 로고
    • High temperature (> 200? C) isolated gate drive topologies for silicon carbide (SiC) JFET
    • S. Waffler, S. D. Round, and J. W. Kolar, "High temperature (> 200°C) isolated gate drive topologies for silicon carbide (SiC) JFET," in Proc. 34th Annu. Conf. IEEE Ind. Electron., 2008, pp. 2867-2872
    • (2008) Proc. 34th Annu. Conf. IEEE Ind. Electron. , pp. 2867-2872
    • Waffler, S.1    Round, S.D.2    Kolar, J.W.3
  • 27
    • 77956507884 scopus 로고    scopus 로고
    • A resonant gate-drive circuit with opticallyisolated control signal and power supply for fast-switching and highvoltage power semiconductor devices
    • H. Fujita and M. Ishigaki, "A resonant gate-drive circuit with opticallyisolated control signal and power supply for fast-switching and highvoltage power semiconductor devices," in Proc. Int.Power Electron. Conf., 2010, pp. 1895-1901
    • (2010) Proc. Int.Power Electron. Conf. , pp. 1895-1901
    • Fujita, H.1    Ishigaki, M.2
  • 31
    • 84866513363 scopus 로고    scopus 로고
    • Cissoid Datasheet[Online]. Available: http://www.cissoid.com/images/ stories/pdf/Datasheets/cmt-opa.pd
    • Cissoid Datasheet
  • 32
    • 0026406134 scopus 로고
    • Mechanical behavior of ceramic capacitors
    • Dec.
    • C. R. Koripella, "Mechanical behavior of ceramic capacitors," IEEE Trans. Compon., Hybrids, Manuf. Technol., vol. 14, no. 4, pp. 718-724, Dec. 1991
    • (1991) IEEE Trans. Compon., Hybrids, Manuf. Technol. , vol.14 , Issue.4 , pp. 718-724
    • Koripella, C.R.1
  • 33
    • 84866491336 scopus 로고    scopus 로고
    • Department of Defense Test Method Standard: Microcircuits, Feb. 10
    • Department of Defense Test Method Standard: Microcircuits. (2010, Feb. 10). MIL-STD-883H [Online]. Available: http://www.dscc.dla.mil/downloads/ milspec/docs/mil-std-883/std883.pdf
    • (2010) MIL-STD-883H
  • 35
    • 81855181413 scopus 로고    scopus 로고
    • Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance
    • Apr.
    • Xiao C. Tao W. Ngo K.D.T. Guo-Quan L. Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance IEEE Trans. Compon., Packag. Manuf. Technol. 2011 1 4 495-501 Apr.
    • (2011) IEEE Trans. Compon., Packag. Manuf. Technol. , vol.1 , Issue.4 , pp. 495-501
    • Xiao, C.1    Tao, W.2    Ngo, K.D.T.3    Guo-Quan, L.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.