-
1
-
-
61649123528
-
Assessing the impact of SiC MOSFETs on converter interfaces for distributed energy resources
-
Jan
-
J. A. Carr, D. Hotz, J. C. Balda, H. A. Mantooth, A. Ong, and A. Agarwal, "Assessing the impact of SiC MOSFETs on converter interfaces for distributed energy resources" IEEE Trans. Power Electron., vol. 24, no. 1, pp. 260-270, Jan. 2009.
-
(2009)
IEEE Trans. Power Electron.
, vol.24
, Issue.1
, pp. 260-270
-
-
Carr, J.A.1
Hotz, D.2
Balda, J.C.3
Mantooth, H.A.4
Ong, A.5
Agarwal, A.6
-
2
-
-
33744974509
-
High temperature operation of a DC-DC power converter utilizing SiC power devices
-
DOI 10.1109/APEC.2005.1452944, 1452944, Twentieth Annual IEEEApplied Power ElectronicsConference and Exposition, APEC 2005
-
B. Ray, J. D. Scofield, R. L. Spyker, B. Jordan, and S. Ryu, "High temperature operation of a DC-DC power converter utilizing SiC power devices" in Proc. 20th Annu. IEEE Appl. Power Electron. Conf. Expo., Mar. 2005, pp. 315-321. (Pubitemid 43860804)
-
(2005)
Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
, vol.1
, pp. 315-321
-
-
Ray, B.1
Scofield, J.D.2
Spyker, R.L.3
Jordan, B.4
Ryu, S.-H.5
-
3
-
-
48949100917
-
Comparisons of SiC MOSFET and Si IGBT based motor drive systems
-
Sep
-
T. Zhao, J. Wang, A. Q. Huang, and A. Agarwal, "Comparisons of SiC MOSFET and Si IGBT based motor drive systems" in Proc. 42nd Annu. IEEE Ind. Appl. Conf., Sep. 2007, pp. 331-335.
-
(2007)
Proc. 42nd Annu. IEEE Ind. Appl. Conf.
, pp. 331-335
-
-
Zhao, T.1
Wang, J.2
Huang, A.Q.3
Agarwal, A.4
-
4
-
-
77954149949
-
A novel high-temperature planar package for SiC multichip phase-leg power module
-
Aug
-
P. Ning, T. G. Lei, F. Wang, G. Lu, K. D. T. Ngo, and K. Rajashekara, "A novel high-temperature planar package for SiC multichip phase-leg power module" IEEE Trans. Power Electron., vol. 25, no. 8, pp. 2059-2067, Aug. 2010.
-
(2010)
IEEE Trans. Power Electron.
, vol.25
, Issue.8
, pp. 2059-2067
-
-
Ning, P.1
Lei, T.G.2
Wang, F.3
Lu, G.4
Ngo, K.D.T.5
Rajashekara, K.6
-
5
-
-
67349133605
-
Design and characterization of high-voltage silicon carbide emitter turn-off thyristor
-
May
-
J. Wang and A. Q. Huang, "Design and characterization of high-voltage silicon carbide emitter turn-off thyristor" IEEE Trans. Power Electron., vol. 24, no. 5, pp. 1189-1197, May 2009.
-
(2009)
IEEE Trans. Power Electron.
, vol.24
, Issue.5
, pp. 1189-1197
-
-
Wang, J.1
Huang, A.Q.2
-
6
-
-
76649133450
-
SiCwirebond multichip phase-leg module packaging design and testing for harsh environments
-
Jan
-
P. Ning, R. Lai, D. Huff, F. Wang, K. D. T. Ngo, V. D. Immanuel, and K. J. Karimi, "SiCwirebond multichip phase-leg module packaging design and testing for harsh environments" IEEE Trans. Power Electron., vol. 25, no. 1, pp. 16-23, Jan. 2010.
-
(2010)
IEEE Trans. Power Electron.
, vol.25
, Issue.1
, pp. 16-23
-
-
Ning, P.1
Lai, R.2
Huff, D.3
Wang, F.4
Ngo, K.D.T.5
Immanuel, V.D.6
Karimi, K.J.7
-
7
-
-
34547102755
-
Power conversion with SiC devices at extremely high ambient temperatures
-
DOI 10.1109/TPEL.2007.900561
-
T. Funaki, J. C. Balda, J. Junghans, A. S. Kashyap, H. A. Mantooth, F. Barlow,T.Kimoto, andT.Hikihara, "Power conversion with SiC devices at extremely high ambient temperatures" IEEE Trans. Power Electron., vol. 22, no. 4, pp. 1321-1329, Jul. 2007. (Pubitemid 47098833)
-
(2007)
IEEE Transactions on Power Electronics
, vol.22
, Issue.4
, pp. 1321-1329
-
-
Funaki, T.1
Balda, J.C.2
Junghans, J.3
Kashyap, A.S.4
Mantooth, H.A.5
Barlow, F.6
Kimoto, T.7
Hikihara, T.8
-
8
-
-
65949090752
-
Hightemperature high-power operation of a 100 A SiC DMOSFET module
-
Feb
-
T. E. Salem, D. P. Urciuoli, R. Green, and G. K. Ovrebo, "Hightemperature high-power operation of a 100 A SiC DMOSFET module" in Proc. 24th Annu. IEEE Appl. Power Electron. Conf. Expo., Feb. 2009, pp. 653-657.
-
(2009)
Proc. 24th Annu. IEEE Appl. Power Electron. Conf. Expo.
, pp. 653-657
-
-
Salem, T.E.1
Urciuoli, D.P.2
Green, R.3
Ovrebo, G.K.4
-
9
-
-
77952126930
-
Reverse conduction of a 100 A SiC DMOSFET module in high-power applications
-
Feb
-
R. A. Wood, D. P. Urciuoli, T. E. Salem, and R. Green, "Reverse conduction of a 100 A SiC DMOSFET module in high-power applications" in Proc. 25th Annu. IEEE Appl. Power Electron. Conf. Expo., Feb. 2010, pp. 1568-1571.
-
(2010)
Proc. 25th Annu. IEEE Appl. Power Electron. Conf. Expo.
, pp. 1568-1571
-
-
Wood, R.A.1
Urciuoli, D.P.2
Salem, T.E.3
Green, R.4
-
10
-
-
72449193073
-
Roadmap for megawatt class power switch modules utilizing large area silicon carbide MOSFETs and JBS diodes
-
Sep
-
J. Richmond, S. Leslie, B. Hull, M. Das, A. Agarwal, and J. Palmour, "Roadmap for megawatt class power switch modules utilizing large area silicon carbide MOSFETs and JBS diodes" in Proc. Energy Convers. Congr. Expo., Sep. 2009, pp. 106-111.
-
(2009)
Proc. Energy Convers. Congr. Expo.
, pp. 106-111
-
-
Richmond, J.1
Leslie, S.2
Hull, B.3
Das, M.4
Agarwal, A.5
Palmour, J.6
-
11
-
-
80053182549
-
Characteristics of a 1200 V, 550 A SiC DMOSFET dual module
-
Nuremberg, Germany, May
-
R. Wood and T. E. Salem, "Characteristics of a 1200 V, 550 A SiC DMOSFET dual module" in Proc. PCIM, Nuremberg, Germany, May 2010, pp. 293-298.
-
(2010)
Proc. PCIM
, pp. 293-298
-
-
Wood, R.1
Salem, T.E.2
-
12
-
-
0036446499
-
New MEGA POWER DUAL™ IGBT module with advanced 1200 V CSTBT chip
-
J. Yamada, Y. Yu, J. F. Donlon, and E. R. Motto, "New MEGA POWER DUALTM IGBT module with advanced 1200 V CSTBT chip" in Proc. 37th Annu. IEEE Ind. Appl. Conf., Oct. 2002, pp. 2159-2164. (Pubitemid 35413707)
-
(2002)
Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)
, vol.3
, pp. 2159-2164
-
-
Yamada, J.1
Yu, Y.2
Donlon, J.F.3
Motto, E.R.4
-
13
-
-
78650122385
-
Performance of a dual, 1200 V, 400 A, silicon-carbide powerMOSFET module
-
Sep
-
D. Urciuoli, R. Green, A. Lelis, and D. Ibitayo, "Performance of a dual, 1200 V, 400 A, silicon-carbide powerMOSFET module" in Proc. Energy Convers. Congr. Expo., Sep. 2010, pp. 3303-3310.
-
(2010)
Proc. Energy Convers. Congr. Expo.
, pp. 3303-3310
-
-
Urciuoli, D.1
Green, R.2
Lelis, A.3
Ibitayo, D.4
-
14
-
-
49249116197
-
A physical model of high temperature 4 H-SiC MOSFETs
-
Aug
-
S. Potbhare, N. Goldsman, A. Lelis, J. M. McGarrity, F. B. McLean, and D. Habersat, "A physical model of high temperature 4 H-SiC MOSFETs" IEEE Trans. Electron Devices, vol. 55, no. 8, pp. 2029-2040, Aug. 2008.
-
(2008)
IEEE Trans. Electron Devices
, vol.55
, Issue.8
, pp. 2029-2040
-
-
Potbhare, S.1
Goldsman, N.2
Lelis, A.3
McGarrity, J.M.4
McLean, F.B.5
Habersat, D.6
-
15
-
-
34648813004
-
Validation of infrared camera thermal measurements on high-voltage power electronic components
-
DOI 10.1109/TIM.2007.903590
-
T. E. Salem, D. Ibitayo, and B. R. Geil, "Validation of infrared camera thermal measurements on high-voltage power electronic components" IEEE Trans. Instrum. Meas., vol. 56, no. 5, pp. 1973-1978, Oct. 2007. (Pubitemid 47455926)
-
(2007)
IEEE Transactions on Instrumentation and Measurement
, vol.56
, Issue.5
, pp. 1973-1978
-
-
Salem, T.E.1
Ibitayo, D.2
Geil, B.R.3
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